{"id":{"repo_id":"mit","oai_identifier":"oai:dspace.mit.edu:1721.1/67760"},"canonical_url":"https://search.dev.ndltd.org/etd/mit/oai:dspace.mit.edu:1721.1/67760","repository":{"repo_id":"mit","name":"MIT","base_url":"https://dspace.mit.edu/oai/request"},"display":{"title":"Competitive pricing and learning in CPU sockets","abstract":"An Intel processor can be electrically attached to a PC motherboard permanently or via a component called a socket. Intel defines the critical interfaces between the socket and the processor. Independent suppliers then manufacture the sockets and Intel validates the design of the sockets before they are sold to the original equipment manufacturers (OEMs). Sockets are the preferred mode of processor attachment for OEMs; however, the increase in price when a new socket is introduced has been a source of complaint by OEMs. This project seeks to better understand what factors contribute to socket costs and what can be done to better understand the increase in price when a new socket is released. This thesis provides a complete analysis on socket supplier development costs and determines that there is an optimal market situation that will minimize the socket cost for OEMs. After investigating different factors it is determined that the number of suppliers and level of competition are most strongly correlated with socket price. Furthermore, research shows that experience curves using competition as a factor are the most useful way of understanding socket price. Recommendations on ideal market share by supplier are provided as part of the results.","abstract_html":"An Intel processor can be electrically attached to a PC motherboard permanently or via a component called a socket. Intel defines the critical interfaces between the socket and the processor. Independent suppliers then manufacture the sockets and Intel validates the design of the sockets before they are sold to the original equipment manufacturers (OEMs). Sockets are the preferred mode of processor attachment for OEMs; however, the increase in price when a new socket is introduced has been a source of complaint by OEMs. This project seeks to better understand what factors contribute to socket costs and what can be done to better understand the increase in price when a new socket is released. This thesis provides a complete analysis on socket supplier development costs and determines that there is an optimal market situation that will minimize the socket cost for OEMs. After investigating different factors it is determined that the number of suppliers and level of competition are most strongly correlated with socket price. Furthermore, research shows that experience curves using competition as a factor are the most useful way of understanding socket price. Recommendations on ideal market share by supplier are provided as part of the results.","abstract_has_math":false,"creators":["Rahman, Mehrafshan Tabassum"],"institution":"Massachusetts Institute of Technology","degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":"Leaders for Global Operations Program at MIT","school":null,"contributors":[],"advisors":["Duane Boning and Donald Rosenfield."],"committee_chairs":[],"committee_members":[],"year":2011,"date_issued":"2011","date_published":"2011","updated_at":"2026-07-22T22:20:48Z","subjects":["Engineering Systems Division.","Sloan School of Management.","Leaders for Global Operations Program."],"languages":["eng"],"rights":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission."],"rights_urls":["http://dspace.mit.edu/handle/1721.1/7582"],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/1721.1/67760","outbound_label":"Handle","outbound_source":"dc:identifier.uri"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor.advisor","label":"Advisor","values":["Duane Boning and Donald Rosenfield."]},{"key":"dc:contributor.department","label":"Department","values":["Leaders for Global Operations Program at MIT","Massachusetts Institute of Technology. Engineering Systems Division","Sloan School of Management"]},{"key":"dc:contributor.other","label":"Dc Contributor Other","values":["Leaders for Global Operations Program."]},{"key":"dc:creator","label":"Author","values":["Rahman, Mehrafshan Tabassum"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date.accessioned","label":"Dc Date Accessioned","values":["2011-12-19T18:47:57Z"]},{"key":"dc:date.available","label":"Dc Date Available","values":["2011-12-19T18:47:57Z"]},{"key":"dc:date.issued","label":"Date","values":["2011"]},{"key":"dc:publisher","label":"Institution","values":["Massachusetts Institute of Technology"]},{"key":"dc:type","label":"Dc Type","values":["Thesis"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Engineering Systems Division.","Sloan School of Management.","Leaders for Global Operations Program."]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language.iso","label":"Language (ISO)","values":["eng"]},{"key":"dc:rights","label":"Dc Rights","values":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission."]},{"key":"dc:rights.uri","label":"Rights URI","values":["http://dspace.mit.edu/handle/1721.1/7582"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier.uri","label":"Identifier URI","values":["http://hdl.handle.net/1721.1/67760"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Thesis (S.M.)--Massachusetts Institute of Technology, Engineering Systems Division; and, (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; in conjunction with the Leaders for Global Operations Program at MIT, 2011.","Cataloged from PDF version of thesis.","Includes bibliographical references (p. 64-66)."]},{"key":"dc:description.abstract","label":"Abstract","values":["An Intel processor can be electrically attached to a PC motherboard permanently or via a component called a socket. Intel defines the critical interfaces between the socket and the processor. Independent suppliers then manufacture the sockets and Intel validates the design of the sockets before they are sold to the original equipment manufacturers (OEMs). Sockets are the preferred mode of processor attachment for OEMs; however, the increase in price when a new socket is introduced has been a source of complaint by OEMs. This project seeks to better understand what factors contribute to socket costs and what can be done to better understand the increase in price when a new socket is released. This thesis provides a complete analysis on socket supplier development costs and determines that there is an optimal market situation that will minimize the socket cost for OEMs. After investigating different factors it is determined that the number of suppliers and level of competition are most strongly correlated with socket price. Furthermore, research shows that experience curves using competition as a factor are the most useful way of understanding socket price. Recommendations on ideal market share by supplier are provided as part of the results."]},{"key":"dc:description.degree","label":"Dc Description Degree","values":["M.B.A.","S.M."]},{"key":"dc:title","label":"Title","values":["Competitive pricing and learning in CPU sockets"]}]}],"canonical_facts":{"dc:contributor.advisor":["Duane Boning and Donald Rosenfield."],"dc:contributor.department":["Leaders for Global Operations Program at MIT","Massachusetts Institute of Technology. Engineering Systems Division","Sloan School of Management"],"dc:contributor.other":["Leaders for Global Operations Program."],"dc:creator":["Rahman, Mehrafshan Tabassum"],"dc:date.accessioned":["2011-12-19T18:47:57Z"],"dc:date.available":["2011-12-19T18:47:57Z"],"dc:date.issued":["2011"],"dc:description":["Thesis (S.M.)--Massachusetts Institute of Technology, Engineering Systems Division; and, (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; in conjunction with the Leaders for Global Operations Program at MIT, 2011.","Cataloged from PDF version of thesis.","Includes bibliographical references (p. 64-66)."],"dc:description.abstract":["An Intel processor can be electrically attached to a PC motherboard permanently or via a component called a socket. Intel defines the critical interfaces between the socket and the processor. Independent suppliers then manufacture the sockets and Intel validates the design of the sockets before they are sold to the original equipment manufacturers (OEMs). Sockets are the preferred mode of processor attachment for OEMs; however, the increase in price when a new socket is introduced has been a source of complaint by OEMs. This project seeks to better understand what factors contribute to socket costs and what can be done to better understand the increase in price when a new socket is released. This thesis provides a complete analysis on socket supplier development costs and determines that there is an optimal market situation that will minimize the socket cost for OEMs. After investigating different factors it is determined that the number of suppliers and level of competition are most strongly correlated with socket price. Furthermore, research shows that experience curves using competition as a factor are the most useful way of understanding socket price. Recommendations on ideal market share by supplier are provided as part of the results."],"dc:description.degree":["M.B.A.","S.M."],"dc:identifier.uri":["http://hdl.handle.net/1721.1/67760"],"dc:language.iso":["eng"],"dc:publisher":["Massachusetts Institute of Technology"],"dc:rights":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission."],"dc:rights.uri":["http://dspace.mit.edu/handle/1721.1/7582"],"dc:subject":["Engineering Systems Division.","Sloan School of Management.","Leaders for Global Operations Program."],"dc:title":["Competitive pricing and learning in CPU sockets"],"dc:type":["Thesis"]},"updated_at":"2026-07-22T22:20:48Z"}