{"id":{"repo_id":"mit","oai_identifier":"oai:dspace.mit.edu:1721.1/62351"},"canonical_url":"https://search.dev.ndltd.org/etd/mit/oai:dspace.mit.edu:1721.1/62351","repository":{"repo_id":"mit","name":"MIT","base_url":"https://dspace.mit.edu/oai/request"},"display":{"title":"E-broidery : an infrastructure for washable computing","abstract":"Wash-and-wear multilayer electronic circuitry can be constructed on fabric substrates, using conductive textiles and suitably packaged components. Fabrics are perhaps the first composite materials engineered by humanity; their evolution led to the development of the Jacquard loom, which itself led to the development of the modern computer. The development of fabric circuitry is a compelling closure of the cycle that points to a new class of textiles which interact with their users and their environments, while retaining the properties that made them the first ubiquitous \"smart material\". Fabrics are in several respects superior to existing flexible substrates in terms of their durability, conformability, and breathability. The present work adopts a modular approach to circuit fabrication, from which follow circuit design techniques and component packages optimized for use in fabric-based circuitry, flexible all-fabric interconnects, and multilayer circuits. While maintaining close compatibility with existing components, tools, and techniques, the present work demonstrates all steps of a process to create multilayer printed circuits on fabric substrates using conductive textiles.","abstract_html":"Wash-and-wear multilayer electronic circuitry can be constructed on fabric substrates, using conductive textiles and suitably packaged components. Fabrics are perhaps the first composite materials engineered by humanity; their evolution led to the development of the Jacquard loom, which itself led to the development of the modern computer. The development of fabric circuitry is a compelling closure of the cycle that points to a new class of textiles which interact with their users and their environments, while retaining the properties that made them the first ubiquitous "smart material". Fabrics are in several respects superior to existing flexible substrates in terms of their durability, conformability, and breathability. The present work adopts a modular approach to circuit fabrication, from which follow circuit design techniques and component packages optimized for use in fabric-based circuitry, flexible all-fabric interconnects, and multilayer circuits. While maintaining close compatibility with existing components, tools, and techniques, the present work demonstrates all steps of a process to create multilayer printed circuits on fabric substrates using conductive textiles.","abstract_has_math":false,"creators":["Post, E. Rehmi, 1966-"],"institution":"Massachusetts Institute of Technology","degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":"Massachusetts Institute of Technology. Dept. of Architecture. Program In Media Arts and Sciences.","school":null,"contributors":[],"advisors":["Neil Gershenfeld."],"committee_chairs":[],"committee_members":[],"year":1999,"date_issued":"1999","date_published":"1999","updated_at":"2026-07-22T22:20:55Z","subjects":["Architecture. Program In Media Arts and Sciences."],"languages":["eng"],"rights":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. 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Fabrics are perhaps the first composite materials engineered by humanity; their evolution led to the development of the Jacquard loom, which itself led to the development of the modern computer. The development of fabric circuitry is a compelling closure of the cycle that points to a new class of textiles which interact with their users and their environments, while retaining the properties that made them the first ubiquitous \"smart material\". Fabrics are in several respects superior to existing flexible substrates in terms of their durability, conformability, and breathability. The present work adopts a modular approach to circuit fabrication, from which follow circuit design techniques and component packages optimized for use in fabric-based circuitry, flexible all-fabric interconnects, and multilayer circuits. While maintaining close compatibility with existing components, tools, and techniques, the present work demonstrates all steps of a process to create multilayer printed circuits on fabric substrates using conductive textiles."]},{"key":"dc:description.degree","label":"Dc Description Degree","values":["S.M."]},{"key":"dc:title","label":"Title","values":["E-broidery : an infrastructure for washable computing"]}]}],"canonical_facts":{"dc:contributor.advisor":["Neil Gershenfeld."],"dc:contributor.department":["Massachusetts Institute of Technology. Dept. of Architecture. Program In Media Arts and Sciences."],"dc:contributor.other":["Massachusetts Institute of Technology. Dept. of Architecture. Program In Media Arts and Sciences."],"dc:creator":["Post, E. 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