Underfill material selection for flip chip technology

Six underfill materials were examined for the selection of an appropriate underfill material for Digital Equipment Corporation's flip chip development project. Several tests were performed to determine the material properties, process properties, and the reliability of each underfill material. A material with a fast flow rate, uniform and void free flow pattern, fast curing schedule, good thermal and mechanical properties, and good reliability results is needed to satisfy the requirements for this project. Materials F and E exhibited all the above requirements and were concluded as the two best underfill materials for the flip chip process. Important material properties which contributed to the desired results of these materials include a filler particle content of about 65%, a weight loss percentage during cure of less than 1%, and a Tg of 140°C.

Department dc:contributor.department

Massachusetts Institute of Technology. Department of Materials Science and Engineering

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

1998

Author dc:creator

• Chiang, Diana C. (Diana Chih-Chan), 1975-

Advisor dc:contributor.advisor

• David K. Roylance.

• Materials Science and Engineering

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/50454

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/50454