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Massachusetts Institute of Technology

Developing a methodology to link printed circuit board assembly yield targets to commodity group quality goals

Abstract

dc:description.abstract

The increasing complexity of high-end routing products, a highly diverse product mix, and continually demanding quality requirements have intensified the challenges faced by Cisco. Primary among these is managing the broad array of suppliers to ensure that the parts they are delivering meet the quality needs of the end product while balancing this with the need to remain cost competitive. Because components are often used across many product lines, it is can be difficult to determine exactly how an improvement to the quality of an individual component will impact Cisco's overall yield metrics. This thesis establishes a methodology for linking component quality to assembly-level yields. The component level quality is measured in Defective Parts Per Million (DPPM) at the Commodity Group level, and PCBA Yield is measured as the percentage of boards which meet Cisco's Six Sigma yield targets. The proof of concept for such an analytical link shows that these two metrics can be analytically related, and furthermore can be used to ensure that the effort expended to improve DPPM is optimally targeted to have an impact on assembly-level yields.

Degree

thesis:*
Department dc:contributor.department
Leaders for Manufacturing Program at MIT
Grantor dc:publisher
Massachusetts Institute of Technology
Year dc:date.issued
2009

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Cauthen, Jason Wessing
Advisor dc:contributor.advisor
  • Roy E. Welsch and David Hardt.

Subjects

dc:subject × 3

Rights

dc:rights
Statement dc:rights
  • M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
Language dc:language.iso
eng

Identifiers

dc:identifier.*
Handle dc:identifier.uri
http://hdl.handle.net/1721.1/49789
OAI identifier oai:identifier
oai:dspace.mit.edu:1721.1/49789

Chain of custody

source
Harvested from
MIT
Base URL
dspace.mit.edu/oai/request
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Cauthen, Jason Wessing. Developing a methodology to link printed circuit board assembly yield targets to commodity group quality goals. Massachusetts Institute of Technology, 2009. http://hdl.handle.net/1721.1/49789