{"id":{"repo_id":"mit","oai_identifier":"oai:dspace.mit.edu:1721.1/45361"},"canonical_url":"https://search.dev.ndltd.org/etd/mit/oai:dspace.mit.edu:1721.1/45361","repository":{"repo_id":"mit","name":"MIT","base_url":"https://dspace.mit.edu/oai/request"},"display":{"title":"Commercialization of silicon on lattice-engineered substrate for electronic applications","abstract":"The commercial potential of SOLES (Silicon on Lattice-Engineered Substrate) is investigated considering the competing technologies, competing market players and market demands. Monolithic integration of Si devices with III-V electronic devices using SOLES could be used to produce single chip wireless IC, catering the need of the most prosperous consumer markets, the mobile phone market and the WLAN/WMAN/WWAN wireless connectivity market. A cost model has been developed to justify the cost effectiveness of single chip wireless IC. The commercial viability of SOLES is commented based on these analyses.","abstract_html":"The commercial potential of SOLES (Silicon on Lattice-Engineered Substrate) is investigated considering the competing technologies, competing market players and market demands. Monolithic integration of Si devices with III-V electronic devices using SOLES could be used to produce single chip wireless IC, catering the need of the most prosperous consumer markets, the mobile phone market and the WLAN/WMAN/WWAN wireless connectivity market. A cost model has been developed to justify the cost effectiveness of single chip wireless IC. The commercial viability of SOLES is commented based on these analyses.","abstract_has_math":false,"creators":["Liang, Yu Yan"],"institution":"Massachusetts Institute of Technology","degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":"Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.","school":null,"contributors":[],"advisors":["Eugene A. Fitzgerald."],"committee_chairs":[],"committee_members":[],"year":2008,"date_issued":"2008","date_published":"2008","updated_at":"2026-07-22T22:21:37Z","subjects":["Materials Science and Engineering."],"languages":["eng"],"rights":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission."],"rights_urls":["http://dspace.mit.edu/handle/1721.1/7582"],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/1721.1/45361","outbound_label":"Handle","outbound_source":"dc:identifier.uri"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor.advisor","label":"Advisor","values":["Eugene A. Fitzgerald."]},{"key":"dc:contributor.department","label":"Department","values":["Massachusetts Institute of Technology. Dept. of Materials Science and Engineering."]},{"key":"dc:contributor.other","label":"Dc Contributor Other","values":["Massachusetts Institute of Technology. Dept. of Materials Science and Engineering."]},{"key":"dc:creator","label":"Author","values":["Liang, Yu Yan"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date.accessioned","label":"Dc Date Accessioned","values":["2009-04-29T17:30:41Z"]},{"key":"dc:date.available","label":"Dc Date Available","values":["2009-04-29T17:30:41Z"]},{"key":"dc:date.issued","label":"Date","values":["2008"]},{"key":"dc:publisher","label":"Institution","values":["Massachusetts Institute of Technology"]},{"key":"dc:type","label":"Dc Type","values":["Thesis"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Materials Science and Engineering."]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language.iso","label":"Language (ISO)","values":["eng"]},{"key":"dc:rights","label":"Dc Rights","values":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission."]},{"key":"dc:rights.uri","label":"Rights URI","values":["http://dspace.mit.edu/handle/1721.1/7582"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier.uri","label":"Identifier URI","values":["http://hdl.handle.net/1721.1/45361"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008.","Includes bibliographical references (leaf 40)."]},{"key":"dc:description.abstract","label":"Abstract","values":["The commercial potential of SOLES (Silicon on Lattice-Engineered Substrate) is investigated considering the competing technologies, competing market players and market demands. Monolithic integration of Si devices with III-V electronic devices using SOLES could be used to produce single chip wireless IC, catering the need of the most prosperous consumer markets, the mobile phone market and the WLAN/WMAN/WWAN wireless connectivity market. A cost model has been developed to justify the cost effectiveness of single chip wireless IC. The commercial viability of SOLES is commented based on these analyses."]},{"key":"dc:description.degree","label":"Dc Description Degree","values":["M.Eng."]},{"key":"dc:title","label":"Title","values":["Commercialization of silicon on lattice-engineered substrate for electronic applications"]}]}],"canonical_facts":{"dc:contributor.advisor":["Eugene A. Fitzgerald."],"dc:contributor.department":["Massachusetts Institute of Technology. Dept. of Materials Science and Engineering."],"dc:contributor.other":["Massachusetts Institute of Technology. Dept. of Materials Science and Engineering."],"dc:creator":["Liang, Yu Yan"],"dc:date.accessioned":["2009-04-29T17:30:41Z"],"dc:date.available":["2009-04-29T17:30:41Z"],"dc:date.issued":["2008"],"dc:description":["Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008.","Includes bibliographical references (leaf 40)."],"dc:description.abstract":["The commercial potential of SOLES (Silicon on Lattice-Engineered Substrate) is investigated considering the competing technologies, competing market players and market demands. Monolithic integration of Si devices with III-V electronic devices using SOLES could be used to produce single chip wireless IC, catering the need of the most prosperous consumer markets, the mobile phone market and the WLAN/WMAN/WWAN wireless connectivity market. A cost model has been developed to justify the cost effectiveness of single chip wireless IC. The commercial viability of SOLES is commented based on these analyses."],"dc:description.degree":["M.Eng."],"dc:identifier.uri":["http://hdl.handle.net/1721.1/45361"],"dc:language.iso":["eng"],"dc:publisher":["Massachusetts Institute of Technology"],"dc:rights":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission."],"dc:rights.uri":["http://dspace.mit.edu/handle/1721.1/7582"],"dc:subject":["Materials Science and Engineering."],"dc:title":["Commercialization of silicon on lattice-engineered substrate for electronic applications"],"dc:type":["Thesis"]},"updated_at":"2026-07-22T22:21:37Z"}