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Massachusetts Institute of Technology

Challenges faced by a global team : the case of the Tool Reuse Program at Intel®

Abstract

dc:description.abstract

The semiconductor industry is characterized by a high cost of capital equipment and fast change in process technology. Therefore Intel ® Corporation as the world's largest semiconductor company has a significant advantage over its competitors in reusing its semiconductor equipments. Not only may the financial impact be considerable, but also Intel ® Corporation can see benefits in process development, equipment reliability, and training. However, demolishing and reusing tools do not go without major difficulties: complexity of the equipments, safety concerns because of the chemical used, reliability of the tool when reused. Consequently, in late 2004, the 6D Program was initiated to preserve Intel's assets during transfer from decontamination through deployment (reuse, resale, part harvesting, donation or scrap) using safe, effective procedure and business processes. In less than 3 years, the 6D Working Group has created procedures, checklists and trainings to assure "best-in-class" performances. This project was set up to support the 6D Working Group's improvement strategy by analyzing gaps that may exist in the system. Especially, the thesis analyzes the challenges faced by the 6D Working Group (a global team) to influence and standardize local practices. By using game theory analysis, recommendations are made to change incentive policy. A new set of metrics is proposed to drive accountability of the sites and foster process improvements. Finally, using a system dynamics approach, the thesis offers insights to answer the question of the adequate level of standardization of processes.

Degree

thesis:*
Department dc:contributor.department
Leaders for Manufacturing Program at MIT
Grantor dc:publisher
Massachusetts Institute of Technology
Year dc:date.issued
2008

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Communal, Alain, 1976-
Advisor dc:contributor.advisor
  • Duane S. Boning and Donald B. Rosenfield.

Subjects

dc:subject × 3

Rights

dc:rights
Statement dc:rights
  • M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
Language dc:language.iso
eng

Identifiers

dc:identifier.*
Handle dc:identifier.uri
http://hdl.handle.net/1721.1/43824
OAI identifier oai:identifier
oai:dspace.mit.edu:1721.1/43824

Chain of custody

source
Harvested from
MIT
Base URL
dspace.mit.edu/oai/request
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Communal, Alain, 1976-. Challenges faced by a global team : the case of the Tool Reuse Program at Intel®. Massachusetts Institute of Technology, 2008. http://hdl.handle.net/1721.1/43824