Process based cost modeling of emerging optoelectronic interconnects : implications for material platform choice

Continuously increasing demand for processing power, storage capacity, and I/O capacity in personal computing, data network, and display interface suggests that optical interconnects may soon supplant copper not only for long distance telecommunication but also for short reach connection needs. In the search for a standard, the current debate in the optoelectronic industry is focused on the technical and economic challenges of the next generation interconnect. Technological advances over the past few years have given new strength to a silicon-technology platform for optoelectronics. The possibility of extending a mature and high-yield Si CMOS manufacturing platform of the electronic industry into the optical domain is an area of intensive interest. Introducing new photonic materials and processes into the mature electronic industry involves a convergence of knowledge between the optoelectronics and semiconductor IC manufacturers. To address some of the technical, market, and organizational uncertainties with the Si platform, this research explores the economic viability and operational hurdles of manufacturing a 1310 nm, 100G Ethernet LAN transceiver. This analysis is carried out using the process-based cost modeling method. Four transceiver designs ranging from the most discrete to a high level of integration are considered on both InP and Si platforms. On the macro-level, this research also explores possible electronic-photonic convergence across industries through a multi-organization, exploratory roadmapping effort. Results have shown 1) integration provides a cost advantage within each material platform.

Department dc:contributor.department

Massachusetts Institute of Technology. Engineering Systems Division

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2008

Author dc:creator

• Liu, Shan, S.M. Massachusetts Institute of Technology

Advisor dc:contributor.advisor

• Randolph E. Kirchain, Jr.

• Technology and Policy Program.
• Engineering Systems Division.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/43182

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/43182