Decision support systems for tool reuse and EOL processes

Intel® is a manufacturing company that concentrates on the fabrication process of computer chips. Over the years and into the future, Intel® has gone through multiple and advanced generations of manufacturing technology caused by new fabrication techniques and increased wafer sizes. These advances have resulted in significant opportunities for cost reduction which includes reuse of semiconductor equipment within Intel factories and sale of used semiconductor equipment. To ensure assets are transferred in a safe and timely manner, Intel developed a 6D program (Decontamination, Decommission, Demolition, Demolition-System, Delivery, and Deployment) to standardize the EOL (End of Life) process of transferring a tool from the factory to its final destination in reuse, sale, parts harvesting, donation or scrap. Like other multi-national companies, Intel® has decentralized manufacturing processes over multiple worldwide sites; most if not all the fabrication, sort, and assembly tool information is archived in multiple repositories/systems. In addition to the scattering of knowledge, the tool-related information appears not to be comprehensive, including data fields not matching across multiple systems.

Department dc:contributor.department

Leaders for Manufacturing Program at MIT

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2007

Author dc:creator

• Gan, Jyeh J

Advisor dc:contributor.advisor

• Donald Rosenfield and Duane S. Boning.

• Sloan School of Management.
• Electrical Engineering and Computer Science.
• Leaders for Manufacturing Program.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/39488

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/39488