Chemical vapor deposition of antimicrobial polymer coatings

There is large and growing interest in making a wide variety of materials and surfaces antimicrobial. Initiated chemical vapor deposition (iCVD), a solventless low-temperature process, is used to form thin films of polymers on fragile substrates. To improve research efficiency, a new combinatorial iCVD system was fabricated and used to efficiently determine the deposition kinetics for two new polymeric thin films, poly(diethylaminoethylacrylate) (PDEAEA) and poly(dimethylaminomethylstyrene) (PDMAMS), both candidates for antimicrobial coatings. Fourier transform infrared (FTIR) spectroscopy shows that functional groups are retained in iCVD of PDMAMS and PDEAEA, whereas essentially all fine chemical structure of the material is destroyed in plasma-enhanced CVD. It was found that the combinatorial system in all cases provided agreement, within experimental certainty, with results of blanket iCVD depositions, thus validating the use of the combinatorial system for future iCVD studies. Finished nylon fabric was subsequently coated with PDMAMS by iCVD with no affect on the color or feel of the fabric. Coatings PDMAMS of up to 540 gg/cm2 were deposited on fabric.

Department dc:contributor.department

Massachusetts Institute of Technology. Dept. of Chemical Engineering.

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2007

Author dc:creator

• Martin, Tyler Philip, 1977-

Advisor dc:contributor.advisor

• Karen K. Gleason.

• Chemical Engineering.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/38968
• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Identifier URI

http://dspace.mit.edu/handle/1721.1/38968

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/38968