Reversible concentric ring microfluidic interconnects

A reversible, Chip-to-Chip microfluidic interconnect was designed for use in high temperature, high pressure applications such as chemical microreactor systems. The interconnect uses two sets of concentric, interlocking rings with trapezoidal cross sections to form a fluid seal without the use of gaskets or sealants. Results from analytical and finite element models indicate good sealing capability. Macro scale devices show that the interconnects function as designed and seal up to 80 psi. Micro scale devices have been fabricated, engage as designed and are much stronger than anticipated, however pressure tests have not yet been conducted.

Department dc:contributor.department

Massachusetts Institute of Technology. Dept. of Mechanical Engineering.

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2004

Author dc:creator

• Thompson, Mary Kathryn, 1980-

Advisor dc:contributor.advisor

• Alexander H. Slocum.

• Mechanical Engineering.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/38277

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/38277