Technology and market analysis of standard electronic photonic package

Electronic industry will suffer a major turn around in the near future. The current infrastructure will no longer be able to support the increasing data rates. All the disadvantages of copper as current legacy are amplified with the level of bandwidth we are going to experience soon. On the other hand, photonic industry is in the need of finding a new demand source to be able to bring back the state of industry to the "boom" era. With both conditions in mind, it is likely for photonic and electronic industry to emerge. However, the platform for the collaboration has not been mature enough. One of the biggest problems in the photonic industry is the high cost of the package. This, so far, has been one of the major issues holding the industry from gaining back to its golden era. In order to overcome this barrier, standardization has been suggested to be implemented in the industry. This thesis examines the current state of optoelectronic industry, as a convergence of photonic and electronic industry. More specifically, the condition of lack of standardization is analyzed and proven to be the case.

Department dc:contributor.department

Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2006

Author dc:creator

• Abdi, Fatwa Firdaus

Advisor dc:contributor.advisor

• Lionel C. Kimerling.

• Materials Science and Engineering.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/37686

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/37686