Improving reuse of semiconductor equipment through benchmarking, standardization, and automation

The 6D program at Intel® Corporation was set up to improve operations around capital equipment reuse, primarily in their semiconductor manufacturing facilities. The company was faced with a number of challenges, including differing work flows across multiple locations, lack of centralized work flow management, discontinuous inventory information, and other opportunities for cost reduction. The internship was set up to benchmark and explore potential for integration of best known methods, accumulated both inside and outside the company. Based on interviews, research and quantitative analysis, opportunities were identified for reuse of equipment shipping crates, improvement in warehouse inventory management, and changes in labor models to facilitate better knowledge capture and dissemination. As a result of this study Intel® Corporation may realize significant improvement in the areas mentioned in terms of cost reduction, process improvement and knowledge management. By using a flexible approach to problem identification and generating organizational interest in the improvements, recommendations were well received and should lead to eventual adoption.

Department dc:contributor.department

Leaders for Manufacturing Program at MIT

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2006

Author dc:creator

• Silber, Jacob B. (Jacob Bradley)

Advisor dc:contributor.advisor

• Donald Rosenfield and David H. Marks.

• Sloan School of Management.
• Civil and Environmental Engineering.
• Leaders for Manufacturing Program.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/37235

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/37235