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Massachusetts Institute of Technology

Process window and variation characterization of the micro embossing process

Abstract

dc:description.abstract

The micro embossing process on polymethylmethacrylate (PMMA) is demonstrated experimentally to be a useful process to produce micro fluidic and optical devices. Because this process is a one step thermoplastic deformation process, it is possible to reach high production rates and low cost in manufacturing compared to the standard clean room processes. Currently, the research about this process is still on the feasibility level, with not a quantitative work to optimize the process parameters and assure product quality. In this thesis, an experimental study on process window and variation of Micro Embossing is presented. This study includes the design and manufacturing of an embossing die, the development of an embossing product quality assessment protocol, the process window characterization and the process variation identification. The research results based on the experimental set up in this thesis show that we should apply constant 800N embossing force at an embossing velocity of 1000N/min in order to obtain well formed parts to maintain low process cycle time.

Degree

thesis:*
Department dc:contributor.department
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Grantor dc:publisher
Massachusetts Institute of Technology
Year dc:date.issued
2006

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Wang, Qi, S.M. Massachusetts Institute of Technology
Advisor dc:contributor.advisor
  • David E. Hardt.

Subjects

dc:subject × 1

Rights

dc:rights
Statement dc:rights
  • M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
Language dc:language.iso
eng

Identifiers

dc:identifier.*
Handle dc:identifier.uri
http://hdl.handle.net/1721.1/35651
OAI identifier oai:identifier
oai:dspace.mit.edu:1721.1/35651

Chain of custody

source
Harvested from
MIT
Base URL
dspace.mit.edu/oai/request
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Wang, Qi, S.M. Massachusetts Institute of Technology. Process window and variation characterization of the micro embossing process. Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/35651