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Massachusetts Institute of Technology

Real time process monitoring of solder paste stencil printing

Abstract

dc:description

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1994.

Degree

thesis:*
Department dc:contributor.department
Massachusetts Institute of Technology. Dept. of Mechanical Engineering
Grantor dc:publisher
Massachusetts Institute of Technology
Year dc:date.issued
1994

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Braunstein, Daniel J. (Daniel Judah)
Advisor dc:contributor.advisor
  • Haruhiko Asada.

Subjects

dc:subject × 1

Rights

dc:rights
Statement dc:rights
  • M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
Language dc:language.iso
eng

Identifiers

dc:identifier.*
Handle dc:identifier.uri
http://hdl.handle.net/1721.1/35374
OAI identifier oai:identifier
oai:dspace.mit.edu:1721.1/35374

Chain of custody

source
Harvested from
MIT
Base URL
dspace.mit.edu/oai/request
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Braunstein, Daniel J. (Daniel Judah). Real time process monitoring of solder paste stencil printing. Massachusetts Institute of Technology, 1994. http://hdl.handle.net/1721.1/35374