Massachusetts Institute of Technology
Implementation of a manufacturing process platform
Abstract
dc:description.abstractAs companies grow and innovate, they offer an increasing number of products. Product proliferation must be managed through a product development process, which is supported by key competencies of the company in the form of platforms. Product and technology platforms have been essential to the success of innovative companies. By leveraging core abilities, companies are able to bring products to market faster and at a lower cost for quality. In this research I present the concept of a manufacturing process platform and a framework for identifying and institutionalizing the platform. I present a case study of a manufacturing group in Eastman Kodak Company which has performed analysis of manufacturing processes and is attempting to implement a manufacturing process platform. Research for this thesis was conducted during a six and a half month internship with Eastman Kodak Company's High Performance Imaging Systems Manufacturing group in Rochester, NY. The internship was affiliated with the Massachusetts Institute of Technology's Leaders for Manufacturing Program.
Degree
thesis:*- Department dc:contributor.department
- Leaders for Manufacturing Program at MIT
- Grantor dc:publisher
- Massachusetts Institute of Technology
- Year dc:date.issued
- 2005
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Ging, Justin D. (Justin Daniel), 1976-
- Advisor dc:contributor.advisor
-
- Roy Welsch and Randolph Kirchain.
Subjects
dc:subject × 3Rights
dc:rights- Statement dc:rights
-
- M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
- Licence dc:rights.uri
- Language dc:language.iso
- eng
Identifiers
dc:identifier.*- Handle dc:identifier.uri
- http://hdl.handle.net/1721.1/34833
- OAI identifier oai:identifier
- oai:dspace.mit.edu:1721.1/34833