{"id":{"repo_id":"mit","oai_identifier":"oai:dspace.mit.edu:1721.1/34706"},"canonical_url":"https://search.dev.ndltd.org/etd/mit/oai:dspace.mit.edu:1721.1/34706","repository":{"repo_id":"mit","name":"MIT","base_url":"https://dspace.mit.edu/oai/request"},"display":{"title":"Optimizing product testing in the electronics manufacturing industry","abstract":"This thesis provides insight into methods for data analysis of testing procedures to optimize the overall testing times within the electronics manufacturing industry. By analyzing each test regime within the manufacturing sequence individually, with the goal of overall test time reduction, better test system optimization may occur. Specifically, within Burn In testing it was found that failure rates were heavily dependent upon the device on/off cycle. Once discovered new test cycles were proposed to reduce overall test times by 50%. Once implemented such new test cycles increased early failure capture as expected. In addition, industry benchmarking studies showed new forms of testing such as Highly Accelerated Stress Testing (HAST) are pushing the product testing earlier into the product life cycle where in-process tests such as Burn In may be reduced. In the case of HAST testing, the tests are being conducted in the design phase reducing more costly Burn In testing in the production phase.","abstract_html":"This thesis provides insight into methods for data analysis of testing procedures to optimize the overall testing times within the electronics manufacturing industry. By analyzing each test regime within the manufacturing sequence individually, with the goal of overall test time reduction, better test system optimization may occur. Specifically, within Burn In testing it was found that failure rates were heavily dependent upon the device on/off cycle. Once discovered new test cycles were proposed to reduce overall test times by 50%. 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