Development of three-dimensional passive components for power electronics

As component and power densities have increased, printed circuit boards (PCBs) have taken on additional functionality including heatsinking and forming constituent parts of electrical components. PCBs are not well suited to these tasks. A novel fabrication method is proposed to develop an enhanced circuit board fabrication approach which overcomes this problem. This method uses a photoresistive scaffold and subsequent metallization to realize the proposed structures. These structures are suitable as heatsinks, inductor windings, busbars and EMI shields among other applications.

Department dc:contributor.department

Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2005

Author dc:creator

• Cantillon-Murphy, Pádraig J

Advisor dc:contributor.advisor

• David J. Perreault.

• Electrical Engineering and Computer Science.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/34679

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/34679