Passive microfluidic interconnects

Equipment and procedures were developed to test two passive microfluidic interconnect rings held together by the friction forces on the contact surfaces. The second design forms fluid seals by means of thin flared rings of compliant material being compressed into undersized sockets. Interconnects were tested in pairs and arrays. The sealing performance of the first design was found to be highly dependent on the material and surface finish of the features, and the design was found to be largely intolerant to the misalignment inherent in arrays. The second design successfully seals up to 150 psi and is capable of compensating for misalignment to seal in arrays of six interconnects.

Department dc:contributor.department

Massachusetts Institute of Technology. Dept. of Mechanical Engineering.

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2005

Author dc:creator

• Jonnalagadda, Aparna S

Advisor dc:contributor.advisor

• Alexander H. Slocum.

• Mechanical Engineering.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/32939

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/32939