Optoelectronic integration using the magnetically assisted statistical assembly technique : initial magnetic characterization and process development

The commercial integration of optoelectronic devices heavily relies on hybrid techniques such as wire bonding and flip-chip bonding. These methods are limited in the scale and flexibility in integration. Research focused on optoelectronic integration is performed using numerous techniques such as direct epitaxy, full-scale wafer bonding, and self-assembly. Magnetically Assisted Statistical Assembly (MASA) is an example of the latter technique and improves scale and flexibility by enabling the simultaneous integration of large numbers of individual devices. This thesis work is focused on the demonstration of the MASA concept through characterization of the magnetic materials forming the foundation for this technique and development of an adequate process technology. Both, the magnetic characteristics and the process technology required to integrate the technology are presented along with results of the integration.

Department dc:contributor.department

Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2002

Author dc:creator

• Rumpler, Joseph John, 1976-

Advisor dc:contributor.advisor

• Clifton G. Fonstad, Jr.

• Electrical Engineering and Computer Science.

Statement dc:rights

• M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

http://hdl.handle.net/1721.1/32714

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/32714