{"id":{"repo_id":"mit","oai_identifier":"oai:dspace.mit.edu:1721.1/30180"},"canonical_url":"https://search.dev.ndltd.org/etd/mit/oai:dspace.mit.edu:1721.1/30180","repository":{"repo_id":"mit","name":"MIT","base_url":"https://dspace.mit.edu/oai/request"},"display":{"title":"Development of pick-and-place assembly techniques for monolithic optopill integration","abstract":"The monolithic heterogeneous integration technology known as Recess Mounting with Monolithic Metallization (RM³) has been under study to integrate III-V heterostructures in the form of optopills on silicon CMOS circuits. Implementation of this technology poses several challenges such as recess filling and optopill bonding to the CMOS circuits. Research focused on establishing assembly techniques to overcome these challenges is performed. This thesis discusses the development of a vacuum tool pick- and-place technique as a solution to recess filling. A novel vacuum film bonding technique was also studied as a method of bonding the pills to the recesses. The results of this bonding technique as well as bonding experiments done using various metal stacks between the pills and recesses are also presented here.","abstract_html":"The monolithic heterogeneous integration technology known as Recess Mounting with Monolithic Metallization (RM³) has been under study to integrate III-V heterostructures in the form of optopills on silicon CMOS circuits. Implementation of this technology poses several challenges such as recess filling and optopill bonding to the CMOS circuits. Research focused on establishing assembly techniques to overcome these challenges is performed. This thesis discusses the development of a vacuum tool pick- and-place technique as a solution to recess filling. A novel vacuum film bonding technique was also studied as a method of bonding the pills to the recesses. The results of this bonding technique as well as bonding experiments done using various metal stacks between the pills and recesses are also presented here.","abstract_has_math":false,"creators":["Teo, Mindy Simin, 1981-"],"institution":"Massachusetts Institute of Technology","degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":"Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.","school":null,"contributors":[],"advisors":["Clifton G. Fonstad, Jr."],"committee_chairs":[],"committee_members":[],"year":2005,"date_issued":"2005","date_published":"2005","updated_at":"2026-07-22T22:22:15Z","subjects":["Electrical Engineering and Computer Science."],"languages":["eng"],"rights":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. 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Implementation of this technology poses several challenges such as recess filling and optopill bonding to the CMOS circuits. Research focused on establishing assembly techniques to overcome these challenges is performed. This thesis discusses the development of a vacuum tool pick- and-place technique as a solution to recess filling. A novel vacuum film bonding technique was also studied as a method of bonding the pills to the recesses. The results of this bonding technique as well as bonding experiments done using various metal stacks between the pills and recesses are also presented here."]},{"key":"dc:description.degree","label":"Dc Description Degree","values":["S.M."]},{"key":"dc:format.mimetype","label":"Dc Format Mimetype","values":["application/pdf"]},{"key":"dc:title","label":"Title","values":["Development of pick-and-place assembly techniques for monolithic optopill integration"]}]}],"canonical_facts":{"dc:contributor.advisor":["Clifton G. Fonstad, Jr."],"dc:contributor.department":["Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science."],"dc:contributor.other":["Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science."],"dc:creator":["Teo, Mindy Simin, 1981-"],"dc:date.accessioned":["2006-03-24T18:27:04Z"],"dc:date.available":["2006-03-24T18:27:04Z"],"dc:date.issued":["2005"],"dc:description":["Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005.","Includes bibliographical references (p. 99-101)."],"dc:description.abstract":["The monolithic heterogeneous integration technology known as Recess Mounting with Monolithic Metallization (RM³) has been under study to integrate III-V heterostructures in the form of optopills on silicon CMOS circuits. Implementation of this technology poses several challenges such as recess filling and optopill bonding to the CMOS circuits. Research focused on establishing assembly techniques to overcome these challenges is performed. This thesis discusses the development of a vacuum tool pick- and-place technique as a solution to recess filling. A novel vacuum film bonding technique was also studied as a method of bonding the pills to the recesses. The results of this bonding technique as well as bonding experiments done using various metal stacks between the pills and recesses are also presented here."],"dc:description.degree":["S.M."],"dc:format.mimetype":["application/pdf"],"dc:identifier.uri":["http://hdl.handle.net/1721.1/30180"],"dc:language.iso":["eng"],"dc:publisher":["Massachusetts Institute of Technology"],"dc:rights":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. 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