{"id":{"repo_id":"mit","oai_identifier":"oai:dspace.mit.edu:1721.1/28543"},"canonical_url":"https://search.dev.ndltd.org/etd/mit/oai:dspace.mit.edu:1721.1/28543","repository":{"repo_id":"mit","name":"MIT","base_url":"https://dspace.mit.edu/oai/request"},"display":{"title":"Substrate resistance extraction using a multi-domain surface integral formulation","abstract":"In recent years, mixed-signal designs have become more pervasive, due to their efficient use of area and power. Unfortunately, with sensitive analog and fast digital circuits sharing a common, non-ideal substrate, such designs carry the additional design burden of electromagnetic coupling between contacts. This thesis presents a method that quickly extracts the electroquasistatic coupling resistances between contacts on a planar, rectangular, two-layer lossy substrate, using an FFT-accelerated multi-domain surface integral formulation. The multi-domain surface integral formulation allows for multi-layered substrates, without meshing the volume. This method has the advantages of easy meshing, simple implementation, and FFT-accelerated iterative methods. Also, a three-dimensional variant of this method allows for more complex substrate geometries than some other surface integral techniques, such as multilayered Green's functions; this three-dimensional problem and its solution are presented in parallel with the planar substrate problem and solution. Results from a C++ implementation are presented for the planar problem.","abstract_html":"In recent years, mixed-signal designs have become more pervasive, due to their efficient use of area and power. Unfortunately, with sensitive analog and fast digital circuits sharing a common, non-ideal substrate, such designs carry the additional design burden of electromagnetic coupling between contacts. This thesis presents a method that quickly extracts the electroquasistatic coupling resistances between contacts on a planar, rectangular, two-layer lossy substrate, using an FFT-accelerated multi-domain surface integral formulation. The multi-domain surface integral formulation allows for multi-layered substrates, without meshing the volume. This method has the advantages of easy meshing, simple implementation, and FFT-accelerated iterative methods. Also, a three-dimensional variant of this method allows for more complex substrate geometries than some other surface integral techniques, such as multilayered Green's functions; this three-dimensional problem and its solution are presented in parallel with the planar substrate problem and solution. Results from a C++ implementation are presented for the planar problem.","abstract_has_math":false,"creators":["Vithayathil, Anne M. (Anne Marie), 1978-"],"institution":"Massachusetts Institute of Technology","degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":"Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.","school":null,"contributors":[],"advisors":["Jacob K. White."],"committee_chairs":[],"committee_members":[],"year":2004,"date_issued":"2004","date_published":"2004","updated_at":"2026-07-22T22:21:05Z","subjects":["Electrical Engineering and Computer Science."],"languages":["en_US"],"rights":["M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. 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The multi-domain surface integral formulation allows for multi-layered substrates, without meshing the volume. This method has the advantages of easy meshing, simple implementation, and FFT-accelerated iterative methods. Also, a three-dimensional variant of this method allows for more complex substrate geometries than some other surface integral techniques, such as multilayered Green's functions; this three-dimensional problem and its solution are presented in parallel with the planar substrate problem and solution. Results from a C++ implementation are presented for the planar problem."],"dc:description.degree":["S.M."],"dc:format.mimetype":["application/pdf"],"dc:identifier.uri":["http://hdl.handle.net/1721.1/28543"],"dc:language.iso":["en_US"],"dc:publisher":["Massachusetts Institute of Technology"],"dc:rights":["M.I.T. theses are protected by copyright. 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