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Massachusetts Institute of Technology

Evaluating the Thermal Stability of Nanocrystalline Ag-Cu Alloys

Abstract

dc:description.abstract

Nanocrystalline alloys offer multitudinous advantages over their larger-grained counterparts including increased strength, hardness, resistance to fatigue, and more. However a significant barrier to their implementation is their low thermal stability—they are prone to coarsening at very low homologous temperatures. Luckily, a thermodynamic approach to stabilizing the microstructures of nanocrystalline metals by adding an alloying element shows great promise. Recent improvements in computational models have facilitated identification of alloy systems in which solute segregation to the grain boundaries is energetically favorable. However, more experimental validation is needed to verify whether their predictions can translate to enhanced thermal stability of alloys in practice. In this work, computational calculations of segregation energies and various processing considerations provided guidance for the selection of the silvercopper system for further study. Procedures were developed to synthesize chemically homogenous nanocrystalline Ag-Cu alloys, and heat treatments with in-situ X-ray diffraction were designed to evaluate their resistance to grain growth at increasing temperatures. Examination of the microstructures of the heat treated samples with focused ion beam and scanning electron microcopy corroborated Scherrer grain size calculations which showed that the alloys with 5 at.% and 25 at.% copper maintained much smaller equilibrium grain sizes at all temperatures in the scope of study compared to pure silver. As was computationally predicted, these data show that the addition of copper can improve the thermal stability of nanocrystalline silver. The experimental validation of these thermodynamic and other system selection criteria provides a framework for the development of novel thermally stable nanocrystalline alloys for countless engineering applications.

Degree

thesis:*
Name thesis:degree_name
Master
Department dc:contributor.department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Grantor dc:publisher
Massachusetts Institute of Technology
Year dc:date.issued
2023

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Sulzman, Serita L.
Advisor dc:contributor.advisor
  • Schuh, Christopher A.

Rights

dc:rights
Statement dc:rights
  • In Copyright - Educational Use Permitted
  • Copyright MIT

Identifiers

dc:identifier.*
Handle dc:identifier.uri
https://hdl.handle.net/1721.1/154174
OAI identifier oai:identifier
oai:dspace.mit.edu:1721.1/154174

Chain of custody

source
Harvested from
MIT
Base URL
dspace.mit.edu/oai/request
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
related terms
citation

Sulzman, Serita L.. Evaluating the Thermal Stability of Nanocrystalline Ag-Cu Alloys. Massachusetts Institute of Technology, 2023. https://hdl.handle.net/1721.1/154174