Back to results

Massachusetts Institute of Technology

Improving Macroscale Defect Detection in Semiconductor Manufacturing using Automated Inspection with Convolutional Neural Networks

Abstract

dc:description.abstract

The work detailed in this thesis explores four distinct pathways of improving wafer macroscale defect detection from both tool-centric and operator-centric perspectives. The primary tool-centric improvement detailed in this work is the implementation of machine learning-enhanced defect detection models to provide recommendations of defective wafers to review operators. This work features the theory, data acquisition and processing, and training steps for three models designed to catch three different defect types. Models are trained on spin-on-glass (SOG) defects, defects around the perimeter of a wafer, and various other defects occurring in the central area of a wafer. SOG defects are the primary focus of this work, also occurring in the central area of a wafer, though much smaller than the defects present in the central defect detection model. After training, the SOG defect detection model achieved an area under curve (AUC) of 0.927 for testing data out of its training data set distribution. The edge model and general central model achieved AUC values of 0.906 and 0.909, respectively, also on out of distribution testing data. These models, and the tools developed for data labeling, can be adopted for automated defect detection, and efficient data tagging for machine learning applications. The other improvement pathways featured in this work involve additional tool-centric improvements of examining and performing corrective action on current wafer inspection tools, and evaluating the potential for in-line wafer inspection during processing. An operator-centric improvement is also detailed, describing the feature, operational, and productivity enhancements associated with the development of a new software interface for wafer image review.

Degree

thesis:*
Name thesis:degree_name
Master
Department dc:contributor.department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Grantor dc:publisher
Massachusetts Institute of Technology
Year dc:date.issued
2023

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Sampson, Jonathan A.
Advisors dc:contributor.advisor
  • Boning, Duane
  • Hardt, David E.

Rights

dc:rights
Statement dc:rights
  • In Copyright - Educational Use Permitted
  • Copyright retained by author(s)

Identifiers

dc:identifier.*
Handle dc:identifier.uri
https://hdl.handle.net/1721.1/152778
OAI identifier oai:identifier
oai:dspace.mit.edu:1721.1/152778

Chain of custody

source
Harvested from
MIT
Base URL
dspace.mit.edu/oai/request
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
related terms
citation

Sampson, Jonathan A.. Improving Macroscale Defect Detection in Semiconductor Manufacturing using Automated Inspection with Convolutional Neural Networks. Massachusetts Institute of Technology, 2023. https://hdl.handle.net/1721.1/152778