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Massachusetts Institute of Technology

Ge and GeSi electroabsorption modulator arrays via strain and composition engineering

Abstract

dc:description.abstract

Electronic and photonic integrated circuits serve as a promising platform for telecommunications and sensing applications. Electroabsorption modulators allow fast modulation, small device footprint, and low power consumption. Epitaxially grown GeSi films on SOI substrates are a suitable materials platform for integrated modulator applications. A modulator's operation wavelength adjustment and its system integration for broadband modulation are two major challenges of fabricating on-chip modulator arrays for telecommunication. Unlike Si MZI modulators, GeSi electroabsorption modulators are not broadband due to its limited working region near absorption edge for the Franz-Keldysh effect. Optimization of a modulator material for a target wavelength can be achieved by tuning material composition or applying strain to the material.

Degree

thesis:*
Name thesis:degree_name
Doctoral
Department dc:contributor.department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Grantor dc:publisher
Massachusetts Institute of Technology
Year dc:date.issued
2020

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Ma, Danhao.
Advisor dc:contributor.advisor
  • Jurgen Michel, Lionel C. Kimerling and Anuradha M. Agarwal.

Subjects

dc:subject × 1

Rights

dc:rights
Statement dc:rights
  • MIT theses may be protected by copyright. Please reuse MIT thesis content according to the MIT Libraries Permissions Policy, which is available through the URL provided.
Language dc:language.iso
eng

Identifiers

dc:identifier.*
Handle dc:identifier.uri
https://hdl.handle.net/1721.1/129033
OAI identifier oai:identifier
oai:dspace.mit.edu:1721.1/129033

Chain of custody

source
Harvested from
MIT
Base URL
dspace.mit.edu/oai/request
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Ma, Danhao.. Ge and GeSi electroabsorption modulator arrays via strain and composition engineering. Massachusetts Institute of Technology, 2020. https://hdl.handle.net/1721.1/129033