Comprehensive modeling of thin film evaporation in micropillar wicks

In the Information Age, society has become accustomed to continuous, rapid advances in electronics technology. As the power density of these devices increases, heat dissipation threatens to become the limiting factor for growth in the electronics industry. In order to sustain rapid growth, the development of advanced thermal management strategies to efficiently dissipate heat from electronics is imperative. Porous wicks are of great interest in thermal management because they are capable of passively supplying liquid for thin film evaporation, a promising method to reliably dissipate heat in high-performance electronics. While the maximum heat flux that can be reliably sustained (the dryout heat flux) has been well-characterized for many wick configurations, key design information is missing as many previous models cannot determine the distribution of evaporator surface temperature nor temperature at the evaporator's interface with electronic components.

Name thesis:degree_name

Master

Department dc:contributor.department

Massachusetts Institute of Technology. Department of Mechanical Engineering

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2019

Author dc:creator

• Vaartstra, Geoffrey.

Advisor dc:contributor.advisor

• Evelyn N. Wang.

• Mechanical Engineering.

Statement dc:rights

• MIT theses may be protected by copyright. Please reuse MIT thesis content according to the MIT Libraries Permissions Policy, which is available through the URL provided.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

https://hdl.handle.net/1721.1/128335

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/128335