Design, fabrication, and characterization of a compact magnetron sputtering system for micro/nano fabrication

A general rule of thumb for new semiconductor fabrication facilities (fabs) is that revenues from the first year of production must match the capital cost of building the fab itself. With modem fabs routinely exceeding $1 billion to build, this rule serves as a significant barrier to entry for groups seeking to commercialize new semiconductor devices aimed at smaller market segments which require a dedicated process. To address this gap in the industry, we are developing a I" Fab line of dedicated tools which processes small 1-2" wafers and feature the same functionality as large-scale commercial micro/nano fabrication tools, but with a significant reduction in cost and footprint. To enable the envisioned 1" Fab a reality, this thesis describes the design, development and testing of a sputtering physical vapor deposition tool, a critical tool in the 1" Fab line of tools.

Name thesis:degree_name

Doctoral

Department dc:contributor.department

Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science

Grantor dc:publisher

Massachusetts Institute of Technology

Year dc:date.issued

2019

Author dc:creator

• Hsing, Mitchell David.

Advisor dc:contributor.advisor

• Martin A. Schmidt.

• Electrical Engineering and Computer Science.

Statement dc:rights

• MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.

Licence dc:rights.uri

• http://dspace.mit.edu/handle/1721.1/7582

Language dc:language.iso

eng

Handle dc:identifier.uri

https://hdl.handle.net/1721.1/122559

OAI identifier oai:identifier

oai:dspace.mit.edu:1721.1/122559