{"id":{"repo_id":"mit","oai_identifier":"oai:dspace.mit.edu:1721.1/115657"},"canonical_url":"https://search.dev.ndltd.org/etd/mit/oai:dspace.mit.edu:1721.1/115657","repository":{"repo_id":"mit","name":"MIT","base_url":"https://dspace.mit.edu/oai/request"},"display":{"title":"Using cold spray to package electronic implants","abstract":"Due to improvements in electronics manufacturing, electronic implants keep decreasing in size and are moving towards integrated-circuit (IC) based designs. As implant electronics become significantly smaller with the use of ICs, traditional implant packaging become a limiting factor on implant miniaturization. Additionally, current packaging techniques can be expensive, and time and labor intensive. Building electronic packages can require many materials, multiple machines, and several manufacturing steps. This thesis explores cold spray as an alternative packaging method that would address the issues associated with traditional packaging. Cold spray could be used to create conformal packaging around electronic implants. Two biocompatible packaging materials, ultra high molecular weight polyethylene (UHMWPE) and titanium, were cold sprayed on two different electronic material substrates, silicon and polyimide. The results from these experiments are presented in this work.","abstract_html":"Due to improvements in electronics manufacturing, electronic implants keep decreasing in size and are moving towards integrated-circuit (IC) based designs. As implant electronics become significantly smaller with the use of ICs, traditional implant packaging become a limiting factor on implant miniaturization. Additionally, current packaging techniques can be expensive, and time and labor intensive. Building electronic packages can require many materials, multiple machines, and several manufacturing steps. This thesis explores cold spray as an alternative packaging method that would address the issues associated with traditional packaging. Cold spray could be used to create conformal packaging around electronic implants. Two biocompatible packaging materials, ultra high molecular weight polyethylene (UHMWPE) and titanium, were cold sprayed on two different electronic material substrates, silicon and polyimide. The results from these experiments are presented in this work.","abstract_has_math":false,"creators":["Berringer, Molly A"],"institution":"Massachusetts Institute of Technology","degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":"Massachusetts Institute of Technology. Department of Mechanical Engineering.","school":null,"contributors":[],"advisors":["Brian W. Anthony and Caroline Bjune."],"committee_chairs":[],"committee_members":[],"year":2018,"date_issued":"2018","date_published":"2018","updated_at":"2026-07-22T22:21:18Z","subjects":["Mechanical Engineering."],"languages":["eng"],"rights":["MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission."],"rights_urls":["http://dspace.mit.edu/handle/1721.1/7582"],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/1721.1/115657","outbound_label":"Handle","outbound_source":"dc:identifier.uri"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor.advisor","label":"Advisor","values":["Brian W. Anthony and Caroline Bjune."]},{"key":"dc:contributor.department","label":"Department","values":["Massachusetts Institute of Technology. Department of Mechanical Engineering."]},{"key":"dc:contributor.other","label":"Dc Contributor Other","values":["Massachusetts Institute of Technology. Department of Mechanical Engineering."]},{"key":"dc:creator","label":"Author","values":["Berringer, Molly A"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date.accessioned","label":"Dc Date Accessioned","values":["2018-05-23T16:29:00Z"]},{"key":"dc:date.available","label":"Dc Date Available","values":["2018-05-23T16:29:00Z"]},{"key":"dc:date.issued","label":"Date","values":["2018"]},{"key":"dc:publisher","label":"Institution","values":["Massachusetts Institute of Technology"]},{"key":"dc:type","label":"Dc Type","values":["Thesis"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Mechanical Engineering."]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language.iso","label":"Language (ISO)","values":["eng"]},{"key":"dc:rights","label":"Dc Rights","values":["MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission."]},{"key":"dc:rights.uri","label":"Rights URI","values":["http://dspace.mit.edu/handle/1721.1/7582"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier.uri","label":"Identifier URI","values":["http://hdl.handle.net/1721.1/115657"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2018.","Cataloged from PDF version of thesis.","Includes bibliographical references (pages 103-105)."]},{"key":"dc:description.abstract","label":"Abstract","values":["Due to improvements in electronics manufacturing, electronic implants keep decreasing in size and are moving towards integrated-circuit (IC) based designs. As implant electronics become significantly smaller with the use of ICs, traditional implant packaging become a limiting factor on implant miniaturization. Additionally, current packaging techniques can be expensive, and time and labor intensive. Building electronic packages can require many materials, multiple machines, and several manufacturing steps. This thesis explores cold spray as an alternative packaging method that would address the issues associated with traditional packaging. Cold spray could be used to create conformal packaging around electronic implants. Two biocompatible packaging materials, ultra high molecular weight polyethylene (UHMWPE) and titanium, were cold sprayed on two different electronic material substrates, silicon and polyimide. The results from these experiments are presented in this work."]},{"key":"dc:description.degree","label":"Dc Description Degree","values":["S.M."]},{"key":"dc:title","label":"Title","values":["Using cold spray to package electronic implants"]}]}],"canonical_facts":{"dc:contributor.advisor":["Brian W. Anthony and Caroline Bjune."],"dc:contributor.department":["Massachusetts Institute of Technology. Department of Mechanical Engineering."],"dc:contributor.other":["Massachusetts Institute of Technology. Department of Mechanical Engineering."],"dc:creator":["Berringer, Molly A"],"dc:date.accessioned":["2018-05-23T16:29:00Z"],"dc:date.available":["2018-05-23T16:29:00Z"],"dc:date.issued":["2018"],"dc:description":["Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2018.","Cataloged from PDF version of thesis.","Includes bibliographical references (pages 103-105)."],"dc:description.abstract":["Due to improvements in electronics manufacturing, electronic implants keep decreasing in size and are moving towards integrated-circuit (IC) based designs. As implant electronics become significantly smaller with the use of ICs, traditional implant packaging become a limiting factor on implant miniaturization. Additionally, current packaging techniques can be expensive, and time and labor intensive. Building electronic packages can require many materials, multiple machines, and several manufacturing steps. This thesis explores cold spray as an alternative packaging method that would address the issues associated with traditional packaging. Cold spray could be used to create conformal packaging around electronic implants. Two biocompatible packaging materials, ultra high molecular weight polyethylene (UHMWPE) and titanium, were cold sprayed on two different electronic material substrates, silicon and polyimide. The results from these experiments are presented in this work."],"dc:description.degree":["S.M."],"dc:identifier.uri":["http://hdl.handle.net/1721.1/115657"],"dc:language.iso":["eng"],"dc:publisher":["Massachusetts Institute of Technology"],"dc:rights":["MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission."],"dc:rights.uri":["http://dspace.mit.edu/handle/1721.1/7582"],"dc:subject":["Mechanical Engineering."],"dc:title":["Using cold spray to package electronic implants"],"dc:type":["Thesis"]},"updated_at":"2026-07-22T22:21:18Z"}