{"id":{"repo_id":"mit","oai_identifier":"oai:dspace.mit.edu:1721.1/111931"},"canonical_url":"https://search.dev.ndltd.org/etd/mit/oai:dspace.mit.edu:1721.1/111931","repository":{"repo_id":"mit","name":"MIT","base_url":"https://dspace.mit.edu/oai/request"},"display":{"title":"Fabrication of a nanoporous membrane device for high heat flux evaporative cooling","abstract":"We investigated the experimental performance of a nanoporous membrane for ultra-high heat flux dissipation from high performance integrated circuits. The biporous evaporation device utilizes thermally-connected, mechanically-supported, high capillarity membranes that maximize thin film evaporation and high permeability liquid supply channels that allow for lower viscous pressure losses. The 600 nm thick membrane was fabricated on a silicon on insulator (SOI) wafer, fusion-bonded to a separate wafer with larger liquid channels. Spreading effects and overall device performance arising from non-uniform heating and evaporation of methanol was captured experimentally. Heat fluxes up to 412 W/cm2, over an area of O.4x 5 mm, and with a temperature rise of 24.1 K from the heated substrate to ambient vapor, were obtained. These results are in good agreement with a high-fidelity, coupled fluid convection and solid conduction compact model, which was necessitated by computational feasibility, which incorporates non-equilibrium and sub-continuum effects at the liquid-vapor interface. This work provides a proof-of-concept demonstration of our biporous evaporation device. Simulations from the validated model, at optimized operating conditions and with improved working fluids, predict heat dissipation in excess of 1 kW/cm2 with a device temperature rise below 30 K, for this scalable cooling approach.","abstract_html":"We investigated the experimental performance of a nanoporous membrane for ultra-high heat flux dissipation from high performance integrated circuits. The biporous evaporation device utilizes thermally-connected, mechanically-supported, high capillarity membranes that maximize thin film evaporation and high permeability liquid supply channels that allow for lower viscous pressure losses. The 600 nm thick membrane was fabricated on a silicon on insulator (SOI) wafer, fusion-bonded to a separate wafer with larger liquid channels. Spreading effects and overall device performance arising from non-uniform heating and evaporation of methanol was captured experimentally. Heat fluxes up to 412 W/cm2, over an area of O.4x 5 mm, and with a temperature rise of 24.1 K from the heated substrate to ambient vapor, were obtained. These results are in good agreement with a high-fidelity, coupled fluid convection and solid conduction compact model, which was necessitated by computational feasibility, which incorporates non-equilibrium and sub-continuum effects at the liquid-vapor interface. This work provides a proof-of-concept demonstration of our biporous evaporation device. Simulations from the validated model, at optimized operating conditions and with improved working fluids, predict heat dissipation in excess of 1 kW/cm2 with a device temperature rise below 30 K, for this scalable cooling approach.","abstract_has_math":false,"creators":["Sircar, Jay D"],"institution":"Massachusetts Institute of Technology","degree_name":null,"degree_level":null,"degree_discipline":null,"degree_department":"Massachusetts Institute of Technology. Department of Mechanical Engineering.","school":null,"contributors":[],"advisors":["Evelyn N. Wang."],"committee_chairs":[],"committee_members":[],"year":2017,"date_issued":"2017","date_published":"2017","updated_at":"2026-07-22T22:22:10Z","subjects":["Mechanical Engineering."],"languages":["eng"],"rights":["MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission."],"rights_urls":["http://dspace.mit.edu/handle/1721.1/7582"],"identifier_entries":[]},"links":{"outbound_url":"http://hdl.handle.net/1721.1/111931","outbound_label":"Handle","outbound_source":"dc:identifier.uri"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor.advisor","label":"Advisor","values":["Evelyn N. Wang."]},{"key":"dc:contributor.department","label":"Department","values":["Massachusetts Institute of Technology. Department of Mechanical Engineering."]},{"key":"dc:contributor.other","label":"Dc Contributor Other","values":["Massachusetts Institute of Technology. Department of Mechanical Engineering."]},{"key":"dc:creator","label":"Author","values":["Sircar, Jay D"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date.accessioned","label":"Dc Date Accessioned","values":["2017-10-18T15:10:32Z"]},{"key":"dc:date.available","label":"Dc Date Available","values":["2017-10-18T15:10:32Z"]},{"key":"dc:date.issued","label":"Date","values":["2017"]},{"key":"dc:publisher","label":"Institution","values":["Massachusetts Institute of Technology"]},{"key":"dc:type","label":"Dc Type","values":["Thesis"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Mechanical Engineering."]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language.iso","label":"Language (ISO)","values":["eng"]},{"key":"dc:rights","label":"Dc Rights","values":["MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission."]},{"key":"dc:rights.uri","label":"Rights URI","values":["http://dspace.mit.edu/handle/1721.1/7582"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier.uri","label":"Identifier URI","values":["http://hdl.handle.net/1721.1/111931"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description","label":"Description","values":["Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2017.","Cataloged from PDF version of thesis.","Includes bibliographical references (pages 60-63)."]},{"key":"dc:description.abstract","label":"Abstract","values":["We investigated the experimental performance of a nanoporous membrane for ultra-high heat flux dissipation from high performance integrated circuits. The biporous evaporation device utilizes thermally-connected, mechanically-supported, high capillarity membranes that maximize thin film evaporation and high permeability liquid supply channels that allow for lower viscous pressure losses. The 600 nm thick membrane was fabricated on a silicon on insulator (SOI) wafer, fusion-bonded to a separate wafer with larger liquid channels. Spreading effects and overall device performance arising from non-uniform heating and evaporation of methanol was captured experimentally. Heat fluxes up to 412 W/cm2, over an area of O.4x 5 mm, and with a temperature rise of 24.1 K from the heated substrate to ambient vapor, were obtained. These results are in good agreement with a high-fidelity, coupled fluid convection and solid conduction compact model, which was necessitated by computational feasibility, which incorporates non-equilibrium and sub-continuum effects at the liquid-vapor interface. This work provides a proof-of-concept demonstration of our biporous evaporation device. Simulations from the validated model, at optimized operating conditions and with improved working fluids, predict heat dissipation in excess of 1 kW/cm2 with a device temperature rise below 30 K, for this scalable cooling approach."]},{"key":"dc:description.degree","label":"Dc Description Degree","values":["S.M."]},{"key":"dc:title","label":"Title","values":["Fabrication of a nanoporous membrane device for high heat flux evaporative cooling"]}]}],"canonical_facts":{"dc:contributor.advisor":["Evelyn N. Wang."],"dc:contributor.department":["Massachusetts Institute of Technology. Department of Mechanical Engineering."],"dc:contributor.other":["Massachusetts Institute of Technology. Department of Mechanical Engineering."],"dc:creator":["Sircar, Jay D"],"dc:date.accessioned":["2017-10-18T15:10:32Z"],"dc:date.available":["2017-10-18T15:10:32Z"],"dc:date.issued":["2017"],"dc:description":["Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2017.","Cataloged from PDF version of thesis.","Includes bibliographical references (pages 60-63)."],"dc:description.abstract":["We investigated the experimental performance of a nanoporous membrane for ultra-high heat flux dissipation from high performance integrated circuits. The biporous evaporation device utilizes thermally-connected, mechanically-supported, high capillarity membranes that maximize thin film evaporation and high permeability liquid supply channels that allow for lower viscous pressure losses. The 600 nm thick membrane was fabricated on a silicon on insulator (SOI) wafer, fusion-bonded to a separate wafer with larger liquid channels. Spreading effects and overall device performance arising from non-uniform heating and evaporation of methanol was captured experimentally. Heat fluxes up to 412 W/cm2, over an area of O.4x 5 mm, and with a temperature rise of 24.1 K from the heated substrate to ambient vapor, were obtained. These results are in good agreement with a high-fidelity, coupled fluid convection and solid conduction compact model, which was necessitated by computational feasibility, which incorporates non-equilibrium and sub-continuum effects at the liquid-vapor interface. This work provides a proof-of-concept demonstration of our biporous evaporation device. Simulations from the validated model, at optimized operating conditions and with improved working fluids, predict heat dissipation in excess of 1 kW/cm2 with a device temperature rise below 30 K, for this scalable cooling approach."],"dc:description.degree":["S.M."],"dc:identifier.uri":["http://hdl.handle.net/1721.1/111931"],"dc:language.iso":["eng"],"dc:publisher":["Massachusetts Institute of Technology"],"dc:rights":["MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission."],"dc:rights.uri":["http://dspace.mit.edu/handle/1721.1/7582"],"dc:subject":["Mechanical Engineering."],"dc:title":["Fabrication of a nanoporous membrane device for high heat flux evaporative cooling"],"dc:type":["Thesis"]},"updated_at":"2026-07-22T22:22:10Z"}