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Massachusetts Institute of Technology
Mathematical and physical modeling of flip-chip soldering processes
Abstract
dc:descriptionThesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995.
Degree
thesis:*- Department dc:contributor.department
- Massachusetts Institute of Technology. Dept. of Materials Science and Engineering
- Grantor dc:publisher
- Massachusetts Institute of Technology
- Year dc:date.issued
- 1995
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Deering, Scott E. (Scott Earl), 1967-
- Advisor dc:contributor.advisor
-
- Julian Szekely.
Subjects
dc:subject × 1Rights
dc:rights- Statement dc:rights
-
- M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
- Licence dc:rights.uri
- Language dc:language.iso
- eng
Identifiers
dc:identifier.*- Handle dc:identifier.uri
- http://hdl.handle.net/1721.1/11115
- OAI identifier oai:identifier
- oai:dspace.mit.edu:1721.1/11115