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Massachusetts Institute of Technology

Sub-Tg̳, solid-state, plasticity-induced bonding of polymeric films and continuous forming

Abstract

dc:description.abstract

If two pieces of a glassy polymer are brought into intimate contact (within molecular proximity) at temperatures well below their glass transition temperature (Tg) negligible adhesion, due to lack of inter-diffusion of macromolecules, will be noted. Because polymer chains are kinetically trapped well below the Tg, the time-scales for relaxations in the glassy state are extremely large, and the system is effectively frozen with respect to any long range diffusive motion. This thesis shows the discovery of a new phenomenon of solid-state, plasticity-induced bonding at temperatures well below Tg which take on the order of a second, by subjecting amorphous polymers to active plastic deformation. In spite of the glassy regime, the bulk plastic deformation triggers requisite molecular mobility of polymer chains to cause inter-penetration across the interface. Quantitative levels of adhesion and morphology of the fractured interfaces validate the sub-Tg, plasticity-induced, molecular mobilization causing bonding. The absence of bonding during compression of films in a near hydrostatic setting (which inhibits plastic flow), and between an 'elastic' and a 'plastic' film, further establishes the explicit role of plastic deformation in this newly reported sub-Tg solid-state bonding. Other components of this thesis comprise the design and fabrication of machines to perform continuous forming and sub-Tg, solid-state bonding of polymer films. A peel-test fixture has also been designed and developed to improve the T-peel test for determination of mode-I fracture toughness of thin and flexible adhered laminates. This research has been conducted as a part of an ongoing activity at the Novartis-MIT Center for Continuous Manufacturing at MIT.

Degree

thesis:*
Department dc:contributor.department
Massachusetts Institute of Technology. Department of Mechanical Engineering.
Grantor dc:publisher
Massachusetts Institute of Technology
Year dc:date.issued
2015

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Padhye, Nikhil, Ph. D. Massachusetts Institute of Technology
Advisor dc:contributor.advisor
  • David M. Parks, Alexander H. Slocum, and Bernhardt L. Trout.

Subjects

dc:subject × 1

Rights

dc:rights
Statement dc:rights
  • M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
Language dc:language.iso
eng

Identifiers

dc:identifier.*
Handle dc:identifier.uri
http://hdl.handle.net/1721.1/101816
OAI identifier oai:identifier
oai:dspace.mit.edu:1721.1/101816

Chain of custody

source
Harvested from
MIT
Base URL
dspace.mit.edu/oai/request
Last updated
2026-07-22
Source record
OAI-PMH GetRecord
citation

Padhye, Nikhil, Ph. D. Massachusetts Institute of Technology. Sub-Tg̳, solid-state, plasticity-induced bonding of polymeric films and continuous forming. Massachusetts Institute of Technology, 2015. http://hdl.handle.net/1721.1/101816