Thermal performance of a Nam-Ju nanostructured copper oscillating heat pipe

As electronic devices increase in performance and decrease in size, more efficient thermal management systems are necessary to combat high heat fluxes. Copper heat pipes, and oscillating heat pipes are devices commonly used in the electronics industry to remove high heat fluxes, safeguarding sensitive electronic components from thermal damage. The surface application of cupric oxide nanostructures to the interior heat pipe channel leads to a reduction of temperatures in the evaporator region of the oscillating heat pipe assembly by as much as 59.1%. The application of cupric oxide nanostructures to the oscillating heat pipe surfaces provides a simple and effective way to further reduce temperature differences between the evaporator and condenser regions of a copper oscillating heat pipe.

Name thesis:degree_name

M.S.

Level thesis:degree_level

Masters

Discipline thesis:degree_discipline

Mechanical and aerospace engineering (MU)

Grantor dc:publisher

University of Missouri--Columbia

Year dc:date.issued

2018

Author dc:creator

• Stover, Stefan

Advisor dc:contributor.advisor

• Winholtz, Robert Andrew, 1961-

Statement dc:rights

• OpenAccess.

Language dc:language.iso

eng, English

DOI

https://doi.org/10.32469/10355/67645

OAI identifier oai:identifier

oai:mospace.umsystem.edu:10355/67645