ULTRA-LOW K DIELECTRIC MATERIALS WITH HIGH BREAKDOWN STRENGTH AND EXCELLENT MECHANICAL PROPERTIES
In this current generation of a rapidly evolving world dominated by computation, there is an ever-existing need to have better materials research for semiconductors. It was estimated by Gordo Moore that the number of transistors that can be fabricated on a chip would double every 18 months, and the focus of every researcher in this domain has remained to meet the projected growth. As electronic devices move to further scales lower in size, the problems associated with fabrication become more ubiquitous. This thesis focuses on Covalent organic frameworks, a recently discovered two-dimensional polymer as a promising material for low permittivity material and its mechanical properties. Herein this report, we synthesize large area, ultra-thin, TpPa-1 2D polymer synthesized from 1,3,5-tri formyl phloroglucinol (Tp) aldehyde and para-phenylenediamine(PPD) as monomers using liquid-liquid interfacial polymerization and evaluate their dielectric and mechanical properties. The permittivities were measured using LCR, breakdown with PolyK Polarisation Loop & Dielectric Breakdown Test System, and mechanical properties using strain-induced elastic buckling instability measurement for mechanical property measurements (SIEBIMM). The breakdown strength of nearly 3.2 GV/m, which is higher than linear polymers. The permittivity values range from 1.7 to 1.2, which is the lowest among any known polymers. Further mechanical Strength of these polymers was found to be around 2.18 GPa (Young’s Modulus). These results strongly suggest that these two-dimension polymers with tunable properties are promising materials that can be used as dielectric layers in semiconductors where low k dielectrics are needed for low signal propagation delay, cross talk, interconnect delay, heat dissipation, and power loss, thus leading way to achieve faster computing time and continued scaling of microelectronic devices.
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