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University of Greenwich

OPISA optoelectronics packaging interfaces for sub-micron alignment

Abstract

dc:description.abstract

For optoelectronic devices submicron precision is required to optimally couple the laser source with the optical fibre. Laser welding is used because of its inherent attributes of accuracy, strength, cleanliness and minimised heat affected zone and structural changes. Due to the rapid solidification of the welded parts post welding residual stresses occur which can lead to a post weld shift between the aligned components and can significantly reduce the light coupling efficiency. Submicron misalignment induced due to the welding process can result in significant power loss. This is a serious and common issue in the manufacture of optoelectronic components and affects production rates. The aim of this work is the development of a methodology that can estimate the residual stresses in the weld piece and to optimise the process by locating the optimal site for micro laser welding. The aim establishes the research question which was addressed by nine objectives. The first eight objectives are elements that comprise the Optoelectronic Packaging Interfaces for Sub-Micron Alignment (OPISA) project. The final objective is the dissemination of this work. Finite element models were developed and used with design of experiments (DoE) statistical technique. This was used to investigate how the key process parameters influence the resultant stress in the optical fibre and to develop a predictive surrogate model. The surrogate model was used with Monte Carlo simulations to determine the fibre stress variation when uncertainty and variation of the design variables are accounted for. The Monte Carlo simulations predicted fibre stress response values which were used to understand how the uncertainties of the input design variables propagate into uncertainty and variation of fibre stress. The surrogate model was used in a sensitivity and risk analysis. The capability analysis of the welding process was also investigated. The original finding of this work is the development of a methodology that fulfils the aim. The work successfully demonstrated that the current industry weld spot location generate 180MPa of post weld stress in the optical fibre. Using the OPISA methodology the optimal weld locations generate 57.6MPa of post weld stress in the optical fibre.

Degree

thesis:*
Name dc:type.qualificationname
phd
Level dc:type.qualificationlevel
doctoral
Grantor dc:publisher.institution
University of Greenwich
Year dc:date.issued
2014

Author and committee

dc:creator, dc:contributor.*
Author dc:creator
  • Malik, Asif
Advisors dc:contributor.advisor
  • Bailey, Christopher
  • Stoyanov, Stoyan

Subjects

dc:subject × 2

Rights

Language dc:language
en

Chain of custody

source
Harvested from
University of Greenwich
Base URL
gala.gre.ac.uk/cgi/oai2
Last updated
2026-07-24
Source record
OAI-PMH GetRecord
citation

Malik, Asif. OPISA optoelectronics packaging interfaces for sub-micron alignment. doctoral thesis, University of Greenwich, 2014.