Novel conductive adhesives for electronic packaging applications: a way towards economical, highly conductive, low temperature and flexible interconnects

Isotropically conductive adhesives (ICAs) are promising as a lead-free interconnect material; However, ICAs have a higher resistivity compared to tin/lead solder. The higher resistivity of ICAs results from the large contact resistance between conductive fillers. Several novel approaches to engineer the interface between electrically conductive fillers were studied to develop highly conductive ICAs. Shown in this dissertation are three methodologies to reduce contact resistance: low temperature sintering, fast sintering and in-situ reduction. Furthermore, two approaches, surface modification and in-situ protection, were developed to prevent oxidation and corrosion of silver-coated copper flakes to produce low cost ICAs. The findings and insights in this dissertation significantly contribute to (1) understanding of filler-filler, filler-polymer and structure-property relationships of ICAs; (2) the structural design and formulation of high performance ICAs; and (3) the wider use of ICAs in emerging applications such as printed electronics and solar cells.

Department dc:contributor.department

Chemistry and Biochemistry

Grantor dc:publisher

Georgia Institute of Technology

Year dc:date.issued

2011

Author dc:creator

• Zhang, Rongwei

Advisor dc:contributor.advisor

• Wong, C. P.

Committee members dc:contributor.committeemember

• Bredas, Jean-Luc
• Collard, David M.
• Perry, Joseph
• Zhang, Z. John

• Reliability
• Interface
• Coupling agent
• Corrosion
• Conductivity mechanism
• Adhesion
• Epoxy
• Sintering
• Conductive polymer composites

Handle dc:identifier.uri

http://hdl.handle.net/1853/39548

OAI identifier oai:identifier

oai:repository.gatech.edu:1853/39548