Influence Of Applied Potential And Metal Ion Concentraion On Metal Electrodeposition At Micron Gap Gold Electrodes

<p>Zamborini and Coworkers developed, a simple, low cost, and highly parallel electrochemical approach for fabricating nano-scale (metal/metal) or molecular (metal/polymer or self-assembled monolayer (SAM)/metal) junctions that should be useful in preparing working sensors and molecular electronic devices. The fabrication of metal/metal junctions involves metal deposition on one set of electrodes (E1), where the metal grows and becomes connected to a second set of electrodes (E2) of an Au interdigitated array of electrodes with a 5 µm separation. However, when different metals were deposited, they deposited in different fashions. Ag grew in the form of wires and Palladium deposited in the form of dendrites. Here we investigated the factors such as applied potential and metal ion concentration on the morphology of the metal electrodeposition across the micron gap electrodes. </p>

Name thesis:degree_name

Master of Science (MS)

Level thesis:degree_level

Master's

Discipline thesis:degree_discipline

Chemistry

Grantor dc:publisher

Eastern Kentucky University

Year

2019

Author dc:creator

• Riggins, Krista Michel

• Ag deposition
• Morphology
• Nanomaterials
• Pd deposition
• Physical Chemistry

Statement dc:rights

• Copyright 2019 Krista Michel Riggins

Repository record dc:identifier

https://encompass.eku.edu/etd/643

OAI identifier oai:identifier

oai:encompass.eku.edu:etd-1641