{"id":{"repo_id":"carleton","oai_identifier":"oai:carleton.scholaris.ca:20.500.14718/44740"},"canonical_url":"https://search.dev.ndltd.org/etd/carleton/oai:carleton.scholaris.ca:20.500.14718/44740","repository":{"repo_id":"carleton","name":"Carleton University","base_url":"https://carleton.scholaris.ca/server/oai/request"},"display":{"title":"Rapid Prototyping of a Directly Heated Thermionic Triode Using 3D Printing Techniques","abstract":"A directly heated thermionic triode was constructed using 3D printing and spot-welding techniques. Thick film silver and encapsulant materials were printed on a soda lime glass substrate to form the triode electrodes and ceramic wall bonding layer respectively. The anode was printed with a layer of silver, and the grid and cathode filament supports were soldered to the remaining electrodes. The triode was characterized in a vacuum chamber to extract µ, its intrinsic gain, for several operating points when the grid was biased to 5 V. A maximum µ just below 25 was measured when the anode was biased at 40 V and the current through the cathode filament was 55 mA.","abstract_html":"A directly heated thermionic triode was constructed using 3D printing and spot-welding techniques. Thick film silver and encapsulant materials were printed on a soda lime glass substrate to form the triode electrodes and ceramic wall bonding layer respectively. The anode was printed with a layer of silver, and the grid and cathode filament supports were soldered to the remaining electrodes. The triode was characterized in a vacuum chamber to extract µ, its intrinsic gain, for several operating points when the grid was biased to 5 V. A maximum µ just below 25 was measured when the anode was biased at 40 V and the current through the cathode filament was 55 mA.","abstract_has_math":false,"creators":["Guy, Noah George Gerry"],"institution":"Carleton University","degree_name":"Master of Applied Science (M.App.Sc.)","degree_level":"Master&apos;s","degree_discipline":"Engineering, Electrical and Computer","degree_department":null,"school":null,"contributors":[],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2025,"date_issued":"2025","date_published":"2025","updated_at":"2026-07-24T01:34:32Z","subjects":[],"languages":["en"],"rights":["Copyright © 2025 the author(s). Theses may be used for non-commercial research, educational, or related academic purposes only. Such uses include personal study, distribution to students, research and scholarship. Theses may only be shared by linking to the Carleton University Institutional Repository and no part may be copied without proper attribution to the author; no part may be used for commercial purposes directly or indirectly via a for-profit platform; no adaptation or derivative works are permitted without consent from the copyright owner."],"rights_urls":[],"identifier_entries":[{"key":"dc:identifier.doi","label":"DOI","values":["10.22215/etd/2025-16713"],"render_values":[{"text":"10.22215/etd/2025-16713","href":"https://doi.org/10.22215/etd/2025-16713","code":true}]}]},"links":{"outbound_url":"https://hdl.handle.net/20.500.14718/44740","outbound_label":"Handle","outbound_source":"dc:identifier.uri"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:creator","label":"Author","values":["Guy, Noah George Gerry"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date.accessioned","label":"Dc Date Accessioned","values":["2026-01-19T15:07:43Z"]},{"key":"dc:date.issued","label":"Date","values":["2025"]},{"key":"dc:publisher","label":"Institution","values":["Carleton University"]},{"key":"dc:type","label":"Dc Type","values":["thesis"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Engineering, Electrical and Computer"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Master&apos;s"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Master of Applied Science (M.App.Sc.)"]}]},{"id":"language_rights","label":"Language and Rights","entries":[{"key":"dc:language.iso","label":"Language (ISO)","values":["en"]},{"key":"dc:rights","label":"Dc Rights","values":["Copyright © 2025 the author(s). 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Thick film silver and encapsulant materials were printed on a soda lime glass substrate to form the triode electrodes and ceramic wall bonding layer respectively. The anode was printed with a layer of silver, and the grid and cathode filament supports were soldered to the remaining electrodes. The triode was characterized in a vacuum chamber to extract µ, its intrinsic gain, for several operating points when the grid was biased to 5 V. A maximum µ just below 25 was measured when the anode was biased at 40 V and the current through the cathode filament was 55 mA."]},{"key":"dc:title","label":"Title","values":["Rapid Prototyping of a Directly Heated Thermionic Triode Using 3D Printing Techniques"]}]}],"canonical_facts":{"dc:creator":["Guy, Noah George Gerry"],"dc:date.accessioned":["2026-01-19T15:07:43Z"],"dc:date.issued":["2025"],"dc:description.abstract":["A directly heated thermionic triode was constructed using 3D printing and spot-welding techniques. Thick film silver and encapsulant materials were printed on a soda lime glass substrate to form the triode electrodes and ceramic wall bonding layer respectively. The anode was printed with a layer of silver, and the grid and cathode filament supports were soldered to the remaining electrodes. The triode was characterized in a vacuum chamber to extract µ, its intrinsic gain, for several operating points when the grid was biased to 5 V. A maximum µ just below 25 was measured when the anode was biased at 40 V and the current through the cathode filament was 55 mA."],"dc:identifier.doi":["10.22215/etd/2025-16713"],"dc:identifier.uri":["https://hdl.handle.net/20.500.14718/44740"],"dc:language.iso":["en"],"dc:publisher":["Carleton University"],"dc:rights":["Copyright © 2025 the author(s). Theses may be used for non-commercial research, educational, or related academic purposes only. Such uses include personal study, distribution to students, research and scholarship. 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