This Thesis describes the design, assembly, programming, and evaluation of the BLDS-M-RAKE, the newest addition to the family of devices called the Boundary Layer Data System (BLDS). The BLDS-M-RAKE is a continuation of the BLDS-M series of devices, a modular approach with updated electronics for boundary layer measurements. The BLDS-M-RAKE records data from a number of sensors, intended to be routed to an array of probes, or rake. Through preliminary testing, a new flexible manifold design from molded silicone and the hardware used on the RFduino development boards from the BLDS-M proof-of-concept modules were validated for use in the final prototype design. A PCB was designed to house a Simblee System on a Chip (SOC), 11 Honeywell pressure sensors, a microUSB socket, a microSD socket, a DC-DC boost regulator, and two AAA cells. The SOC was then programmed in C++ with the Arduino IDE. The Simblee was programmed to prompt a user over a serial monitor to confirm test parameters from a configuration file and then coordinates the reading and recording of sensor data during a flight test. Problems after assembly did not allow a full evaluation of the board, but the following was concluded: the sleeping board current draw was less than 3 mA and the peak current draw was less than 30 mA. The sensors could be sampled at 100 Hz and recorded to the microSD card. The flexible manifolds molded from silicone are viable for future designs.
","abstract_html":"<p>This Thesis describes the design, assembly, programming, and evaluation of the BLDS-M-RAKE, the newest addition to the family of devices called the Boundary Layer Data System (BLDS). The BLDS-M-RAKE is a continuation of the BLDS-M series of devices, a modular approach with updated electronics for boundary layer measurements. The BLDS-M-RAKE records data from a number of sensors, intended to be routed to an array of probes, or rake. Through preliminary testing, a new flexible manifold design from molded silicone and the hardware used on the RFduino development boards from the BLDS-M proof-of-concept modules were validated for use in the final prototype design. A PCB was designed to house a Simblee System on a Chip (SOC), 11 Honeywell pressure sensors, a microUSB socket, a microSD socket, a DC-DC boost regulator, and two AAA cells. The SOC was then programmed in C++ with the Arduino IDE. The Simblee was programmed to prompt a user over a serial monitor to confirm test parameters from a configuration file and then coordinates the reading and recording of sensor data during a flight test. Problems after assembly did not allow a full evaluation of the board, but the following was concluded: the sleeping board current draw was less than 3 mA and the peak current draw was less than 30 mA. The sensors could be sampled at 100 Hz and recorded to the microSD card. The flexible manifolds molded from silicone are viable for future designs.</p>","abstract_has_math":false,"creators":["Hoyt, Nathan Jeffry"],"institution":null,"degree_name":"MS in Mechanical Engineering","degree_level":null,"degree_discipline":"Mechanical Engineering","degree_department":null,"school":null,"contributors":["Russell Westphal","Mechanical Engineering","College of Engineering"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2019,"date_issued":"2019-06-01T07:00:00Z","date_published":"2019-06-01T07:00:00Z","updated_at":"2026-07-24T01:32:13Z","subjects":["Pressure measurement","BLDS","Modular","Flexible manifold","Simblee","C++","Electro-Mechanical Systems"],"languages":[],"rights":[],"rights_urls":[],"identifier_entries":[{"key":"dc:identifier","label":"Identifier","values":["10.15368/theses.2019.108"],"render_values":[{"text":"10.15368/theses.2019.108","href":"https://doi.org/10.15368/theses.2019.108","code":true}]}]},"links":{"outbound_url":"https://digitalcommons.calpoly.edu/theses/2123","outbound_label":"Repository record","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Russell Westphal","Mechanical Engineering","College of Engineering"]},{"key":"dc:creator","label":"Author","values":["Hoyt, Nathan Jeffry"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date.available","label":"Dc Date Available","values":["2019-07-05T07:00:00Z"]},{"key":"thesis:degree_discipline","label":"Discipline","values":["Mechanical Engineering"]},{"key":"thesis:degree_name","label":"Degree Name","values":["MS in Mechanical Engineering"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Pressure measurement","BLDS","Modular","Flexible manifold","Simblee","C++","Electro-Mechanical Systems"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["https://digitalcommons.calpoly.edu/theses/2123","10.15368/theses.2019.108"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description.abstract","label":"Abstract","values":["This Thesis describes the design, assembly, programming, and evaluation of the BLDS-M-RAKE, the newest addition to the family of devices called the Boundary Layer Data System (BLDS). The BLDS-M-RAKE is a continuation of the BLDS-M series of devices, a modular approach with updated electronics for boundary layer measurements. The BLDS-M-RAKE records data from a number of sensors, intended to be routed to an array of probes, or rake. Through preliminary testing, a new flexible manifold design from molded silicone and the hardware used on the RFduino development boards from the BLDS-M proof-of-concept modules were validated for use in the final prototype design. A PCB was designed to house a Simblee System on a Chip (SOC), 11 Honeywell pressure sensors, a microUSB socket, a microSD socket, a DC-DC boost regulator, and two AAA cells. The SOC was then programmed in C++ with the Arduino IDE. The Simblee was programmed to prompt a user over a serial monitor to confirm test parameters from a configuration file and then coordinates the reading and recording of sensor data during a flight test. Problems after assembly did not allow a full evaluation of the board, but the following was concluded: the sleeping board current draw was less than 3 mA and the peak current draw was less than 30 mA. The sensors could be sampled at 100 Hz and recorded to the microSD card. The flexible manifolds molded from silicone are viable for future designs.
"]},{"key":"dc:title","label":"Title","values":["Compact Rake Boundary Layer Data System Module"]}]}],"canonical_facts":{"dc:contributor":["Russell Westphal","Mechanical Engineering","College of Engineering"],"dc:creator":["Hoyt, Nathan Jeffry"],"dc:date.available":["2019-07-05T07:00:00Z"],"dc:description.abstract":["This Thesis describes the design, assembly, programming, and evaluation of the BLDS-M-RAKE, the newest addition to the family of devices called the Boundary Layer Data System (BLDS). The BLDS-M-RAKE is a continuation of the BLDS-M series of devices, a modular approach with updated electronics for boundary layer measurements. The BLDS-M-RAKE records data from a number of sensors, intended to be routed to an array of probes, or rake. Through preliminary testing, a new flexible manifold design from molded silicone and the hardware used on the RFduino development boards from the BLDS-M proof-of-concept modules were validated for use in the final prototype design. A PCB was designed to house a Simblee System on a Chip (SOC), 11 Honeywell pressure sensors, a microUSB socket, a microSD socket, a DC-DC boost regulator, and two AAA cells. The SOC was then programmed in C++ with the Arduino IDE. The Simblee was programmed to prompt a user over a serial monitor to confirm test parameters from a configuration file and then coordinates the reading and recording of sensor data during a flight test. Problems after assembly did not allow a full evaluation of the board, but the following was concluded: the sleeping board current draw was less than 3 mA and the peak current draw was less than 30 mA. The sensors could be sampled at 100 Hz and recorded to the microSD card. The flexible manifolds molded from silicone are viable for future designs.
"],"dc:identifier":["https://digitalcommons.calpoly.edu/theses/2123","10.15368/theses.2019.108"],"dc:subject":["Pressure measurement","BLDS","Modular","Flexible manifold","Simblee","C++","Electro-Mechanical Systems"],"dc:title":["Compact Rake Boundary Layer Data System Module"],"thesis:degree_discipline":["Mechanical Engineering"],"thesis:degree_name":["MS in Mechanical Engineering"]},"updated_at":"2026-07-24T01:32:13Z"}