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State University of New York at Buffalo
Chemical-Free Metal-PDMS Thermal Bonding in Flexible Electrode Fabrication
Abstract
dc:descriptionPh.D.
Degree
thesis:*- Grantor dc:publisher
- State University of New York at Buffalo
- Year dc:date
- 2019
Author and committee
dc:creator, dc:contributor.*- Author dc:creator
-
- Koh, Domin
- Contributors dc:contributor
-
- Oh, Kwang
- Electrical Engineering
Subjects
dc:subject × 2Rights
dc:rights- Statement dc:rights
-
- Users of works found in University at Buffalo Institutional Repository (UBIR) are responsible for identifying and contacting the copyright owner for permission to reuse. University at Buffalo Libraries do not manage rights for copyright-protected works and cannot assist with permissions.
- Copyright retained by author.
- Language dc:language
- eng
Identifiers
dc:identifier.*- Handle dc:identifier
- http://hdl.handle.net/10477/79398
- OAI identifier oai:identifier
- oai:ubir.buffalo.edu:10477/79398