With the high pace of innovation in the semiconductor manufacturing industry, there has been an increasing demand for more energy efficient and environmental friendly products. This research relates to a complex process of fluid dispensing at low volumes on a printed circuit board. Currently, a more refined non-contact dispensing terminology named “Streaming” is widely used to stream out material at low volumes for various applications. The key solution is to frame a dispensing method that lends itself most closely to the requirements of a specific production process.
This study represents a detailed approach of dispensing low volumes of materials in terms of weight per pulse having target weight being less than or equivalent to 0.050 mg. This feature is defined through characterizing the dispensing pump to get the desired weight per pulse with good weight repeatability, dot diameter repeatability, dot quality, and process capability through experimental design runs.
","abstract_html":"<p>With the high pace of innovation in the semiconductor manufacturing industry, there has been an increasing demand for more energy efficient and environmental friendly products. This research relates to a complex process of fluid dispensing at low volumes on a printed circuit board. Currently, a more refined non-contact dispensing terminology named “Streaming” is widely used to stream out material at low volumes for various applications. The key solution is to frame a dispensing method that lends itself most closely to the requirements of a specific production process.</p> <p>This study represents a detailed approach of dispensing low volumes of materials in terms of weight per pulse having target weight being less than or equivalent to 0.050 mg. This feature is defined through characterizing the dispensing pump to get the desired weight per pulse with good weight repeatability, dot diameter repeatability, dot quality, and process capability through experimental design runs.</p>","abstract_has_math":false,"creators":["AGARWAL, SUNNY","Sunny Agarwal (0009-0007-6780-7174) - ORCID
"],"institution":null,"degree_name":"Master of Science in Industrial Engineering (MSIE)","degree_level":"Thesis","degree_discipline":"Systems Science and Industrial Engineering","degree_department":null,"school":null,"contributors":["Dr. Daryl Santos","Dr. Nagen Nagarur","Tom Karlinski"],"advisors":[],"committee_chairs":[],"committee_members":[],"year":2013,"date_issued":"2013-08-12T07:00:00Z","date_published":"2013-08-12T07:00:00Z","updated_at":"2026-07-24T01:10:37Z","subjects":["Adhesive Dispensing","Epoxies","Gage R&R","Jetting","Printed Circuit Board","Process Capability Index","Semiconductors","Statistical Process Control","Surface Mount Technology","Underfill Materials","Complex Fluids","Electro-Mechanical Systems","Electronic Devices and Semiconductor Manufacturing","Industrial Engineering","Manufacturing","Other Operations Research, Systems Engineering and Industrial Engineering","Polymer and Organic Materials","Process Control and Systems","Semiconductor and Optical Materials"],"languages":[],"rights":[],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"https://orb.binghamton.edu/dissertation_and_theses/438","outbound_label":"Repository record","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Dr. Daryl Santos","Dr. Nagen Nagarur","Tom Karlinski"]},{"key":"dc:creator","label":"Author","values":["AGARWAL, SUNNY","Sunny Agarwal (0009-0007-6780-7174) - ORCID
"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"thesis:degree_discipline","label":"Discipline","values":["Systems Science and Industrial Engineering"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Thesis"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Master of Science in Industrial Engineering (MSIE)"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Adhesive Dispensing","Epoxies","Gage R&R","Jetting","Printed Circuit Board","Process Capability Index","Semiconductors","Statistical Process Control","Surface Mount Technology","Underfill Materials","Complex Fluids","Electro-Mechanical Systems","Electronic Devices and Semiconductor Manufacturing","Industrial Engineering","Manufacturing","Other Operations Research, Systems Engineering and Industrial Engineering","Polymer and Organic Materials","Process Control and Systems","Semiconductor and Optical Materials"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["https://orb.binghamton.edu/dissertation_and_theses/438"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description.abstract","label":"Abstract","values":["With the high pace of innovation in the semiconductor manufacturing industry, there has been an increasing demand for more energy efficient and environmental friendly products. This research relates to a complex process of fluid dispensing at low volumes on a printed circuit board. Currently, a more refined non-contact dispensing terminology named “Streaming” is widely used to stream out material at low volumes for various applications. The key solution is to frame a dispensing method that lends itself most closely to the requirements of a specific production process.
This study represents a detailed approach of dispensing low volumes of materials in terms of weight per pulse having target weight being less than or equivalent to 0.050 mg. This feature is defined through characterizing the dispensing pump to get the desired weight per pulse with good weight repeatability, dot diameter repeatability, dot quality, and process capability through experimental design runs.
"]},{"key":"dc:title","label":"Title","values":["Low Volume Dispensing with High Speed Dispensers"]}]}],"canonical_facts":{"dc:contributor":["Dr. Daryl Santos","Dr. Nagen Nagarur","Tom Karlinski"],"dc:creator":["AGARWAL, SUNNY","Sunny Agarwal (0009-0007-6780-7174) - ORCID
"],"dc:description.abstract":["With the high pace of innovation in the semiconductor manufacturing industry, there has been an increasing demand for more energy efficient and environmental friendly products. This research relates to a complex process of fluid dispensing at low volumes on a printed circuit board. Currently, a more refined non-contact dispensing terminology named “Streaming” is widely used to stream out material at low volumes for various applications. The key solution is to frame a dispensing method that lends itself most closely to the requirements of a specific production process.
This study represents a detailed approach of dispensing low volumes of materials in terms of weight per pulse having target weight being less than or equivalent to 0.050 mg. This feature is defined through characterizing the dispensing pump to get the desired weight per pulse with good weight repeatability, dot diameter repeatability, dot quality, and process capability through experimental design runs.
"],"dc:identifier":["https://orb.binghamton.edu/dissertation_and_theses/438"],"dc:subject":["Adhesive Dispensing","Epoxies","Gage R&R","Jetting","Printed Circuit Board","Process Capability Index","Semiconductors","Statistical Process Control","Surface Mount Technology","Underfill Materials","Complex Fluids","Electro-Mechanical Systems","Electronic Devices and Semiconductor Manufacturing","Industrial Engineering","Manufacturing","Other Operations Research, Systems Engineering and Industrial Engineering","Polymer and Organic Materials","Process Control and Systems","Semiconductor and Optical Materials"],"dc:title":["Low Volume Dispensing with High Speed Dispensers"],"thesis:degree_discipline":["Systems Science and Industrial Engineering"],"thesis:degree_level":["Thesis"],"thesis:degree_name":["Master of Science in Industrial Engineering (MSIE)"]},"updated_at":"2026-07-24T01:10:37Z"}