Designing a digital circuit to operate in an extreme temperature range is a challenge with increasing demand for a solution. Large variations in temperature have a distinct impact on electron mobilities causing substantial changes to the threshold voltage of the devices. These physical changes affect the setup and hold times of clocked components, such as D-Flip Flops, of a traditional synchronous digital circuit. Focusing primarily on high temperature circuit operation, this dissertation presents a digital circuit design methodology pairing an asynchronous circuit design paradigm called NULL Convention Logic (NCL) as well as traditional Boolean circuitry with a wide-bandgap semiconductor material, Silicon Carbide (SiC). A total of nineteen circuits have been designed and fabricated. Chip testing results show correct operation for all circuits returned from fabrication, with most performing at or above the targeted temperature of 300°C.
","abstract_html":"<p>Designing a digital circuit to operate in an extreme temperature range is a challenge with increasing demand for a solution. Large variations in temperature have a distinct impact on electron mobilities causing substantial changes to the threshold voltage of the devices. These physical changes affect the setup and hold times of clocked components, such as D-Flip Flops, of a traditional synchronous digital circuit. Focusing primarily on high temperature circuit operation, this dissertation presents a digital circuit design methodology pairing an asynchronous circuit design paradigm called NULL Convention Logic (NCL) as well as traditional Boolean circuitry with a wide-bandgap semiconductor material, Silicon Carbide (SiC). A total of nineteen circuits have been designed and fabricated. Chip testing results show correct operation for all circuits returned from fabrication, with most performing at or above the targeted temperature of 300°C.</p>","abstract_has_math":false,"creators":["Caley, Landon John"],"institution":null,"degree_name":"Doctor of Philosophy in Engineering (PhD)","degree_level":"Dissertation","degree_discipline":null,"degree_department":null,"school":null,"contributors":["Mantooth, H. Alan"],"advisors":["Di, Jia"],"committee_chairs":[],"committee_members":[],"year":2015,"date_issued":"2015-05-01T07:00:00Z","date_published":"2015-05-01T07:00:00Z","updated_at":"2026-07-24T00:59:32Z","subjects":["Asynchronous","Design flow","Digital","High temperature","Integrated circuit","Silicon carbide","Electrical and Computer Engineering","VLSI and Circuits, Embedded and Hardware Systems"],"languages":[],"rights":[],"rights_urls":[],"identifier_entries":[]},"links":{"outbound_url":"https://scholarworks.uark.edu/etd/30","outbound_label":"Repository record","outbound_source":"dc:identifier"},"metadata_groups":[{"id":"people","label":"People","entries":[{"key":"dc:contributor","label":"Contributor","values":["Mantooth, H. Alan"]},{"key":"dc:contributor.advisor","label":"Advisor","values":["Di, Jia"]},{"key":"dc:creator","label":"Author","values":["Caley, Landon John"]}]},{"id":"academic_context","label":"Academic Context","entries":[{"key":"dc:date","label":"Dc Date","values":["2015"]},{"key":"dc:date.available","label":"Dc Date Available","values":["2016-03-17T07:00:00Z"]},{"key":"thesis:degree_level","label":"Degree Level","values":["Dissertation"]},{"key":"thesis:degree_name","label":"Degree Name","values":["Doctor of Philosophy in Engineering (PhD)"]}]},{"id":"subjects_keywords","label":"Subjects and Keywords","entries":[{"key":"dc:subject","label":"Dc Subject","values":["Asynchronous","Design flow","Digital","High temperature","Integrated circuit","Silicon carbide","Electrical and Computer Engineering","VLSI and Circuits, Embedded and Hardware Systems"]}]},{"id":"identifiers","label":"Identifiers","entries":[{"key":"dc:identifier","label":"Identifier","values":["https://scholarworks.uark.edu/etd/30"]}]},{"id":"additional","label":"Additional Metadata","entries":[{"key":"dc:description.abstract","label":"Abstract","values":["Designing a digital circuit to operate in an extreme temperature range is a challenge with increasing demand for a solution. Large variations in temperature have a distinct impact on electron mobilities causing substantial changes to the threshold voltage of the devices. These physical changes affect the setup and hold times of clocked components, such as D-Flip Flops, of a traditional synchronous digital circuit. Focusing primarily on high temperature circuit operation, this dissertation presents a digital circuit design methodology pairing an asynchronous circuit design paradigm called NULL Convention Logic (NCL) as well as traditional Boolean circuitry with a wide-bandgap semiconductor material, Silicon Carbide (SiC). A total of nineteen circuits have been designed and fabricated. Chip testing results show correct operation for all circuits returned from fabrication, with most performing at or above the targeted temperature of 300°C.
"]},{"key":"dc:title","label":"Title","values":["High Temperature CMOS Silicon Carbide Asynchronous Circuit Design"]}]}],"canonical_facts":{"dc:contributor":["Mantooth, H. Alan"],"dc:contributor.advisor":["Di, Jia"],"dc:creator":["Caley, Landon John"],"dc:date":["2015"],"dc:date.available":["2016-03-17T07:00:00Z"],"dc:description.abstract":["Designing a digital circuit to operate in an extreme temperature range is a challenge with increasing demand for a solution. Large variations in temperature have a distinct impact on electron mobilities causing substantial changes to the threshold voltage of the devices. These physical changes affect the setup and hold times of clocked components, such as D-Flip Flops, of a traditional synchronous digital circuit. Focusing primarily on high temperature circuit operation, this dissertation presents a digital circuit design methodology pairing an asynchronous circuit design paradigm called NULL Convention Logic (NCL) as well as traditional Boolean circuitry with a wide-bandgap semiconductor material, Silicon Carbide (SiC). A total of nineteen circuits have been designed and fabricated. Chip testing results show correct operation for all circuits returned from fabrication, with most performing at or above the targeted temperature of 300°C.
"],"dc:identifier":["https://scholarworks.uark.edu/etd/30"],"dc:subject":["Asynchronous","Design flow","Digital","High temperature","Integrated circuit","Silicon carbide","Electrical and Computer Engineering","VLSI and Circuits, Embedded and Hardware Systems"],"dc:title":["High Temperature CMOS Silicon Carbide Asynchronous Circuit Design"],"thesis:degree_level":["Dissertation"],"thesis:degree_name":["Doctor of Philosophy in Engineering (PhD)"]},"updated_at":"2026-07-24T00:59:32Z"}