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Showing 1 to 1 of 1 for “"wirebond-less interconnect"”.
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Fabrication Refinements of Advanced Packaging Techniques for Medium-Voltage Wirebond-less Multi-Chip Power Modules
… power electronic applications. Low-inductance, wirebond-less, high-density, scalable modules are possible due to advanced packaging methods. While beneficial to the operation and design, these techniques introduce new challenges to the fabrication process. This requires refinement to improve the …