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Showing 1 to 2 of 2 for “"wire-bond packaging"”.
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Double-Sided Liquid Cooling for Power Semiconductor Devices Using Embedded Power Technology
… or multi-phase flow, can be implemented with non-wire bond packaging to improve thermal management while maintaining proper electrical performance. Embedded power is one such packaging technology, which provides a compact structure for interface of power semiconductor to fluid flow. The objective …
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Electrical Integration of SiC Power Devices for High-Power-Density Applications
… and high-power operations, integrated wire-bond phase-leg modules are also developed with SiC MOSFET bare dice. High-temperature packaging materials are carefully selected based on an extensive literature survey. The design considerations of improved substrate layout, laminated bus …