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Showing 1 to 1 of 1 for “"wafer-bonded chip"”.

  1. Development of Bi-Directional Module using Wafer-Bonded Chips

    … characteristics that are superior to wire-bonded counterpart. Such structure, however, induces more than twice the thermo-mechanical stress in a single-layer structure. Compressive posts have been developed and integrated into the double-sided module to reduce the stress to a level …

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