Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
Results
Showing 1 to 1 of 1 for “"wafer warpage"”.
-
Numerical Modeling Analysis of Wafer Warpage and Carrier Mobility Change due to Tapered Through-Silicon-Via Geometry
… overlooked issue is that tapered TSV can cause wafer warpage during the fabrication processes. Wafer warpage can cause chip misalignment and impose additional deformation. In an effort to investigate the TSV geometric effect, a large number of finite element analysis (FEA) simulations were …