Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 4 of 4 for “"wafer cleaning"”.
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Optimization of surface preparation technique for unipolar silicon direct bonding
A special wafer bonding method called the Silicon Direct Bonding technique is used to study the bonding of unipolar (n-type, <100> oriented) silicon wafers. The primary objective of this thesis project is to find an optimum surface preparation technique for subsequent silicon wafer bonding. Wafer …
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Cost benefit analysis of process change implementation : alternate wet cleaning technology in the semiconductor manufacturing industry
Maintaining wafer surfaces free of contamination is an essential requirement for the successful fabrication of semiconductor devices. With the growing trend of increased device complexity and reduction of device feature sizes, the area of wet cleaning of substrate surfaces has gained importance. …
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Design principles for high performance, low environmental impact silicon cleans
… control of impurities on the silicon surface. Cleaning of silicon wafers has historically involved the use of concentrated chemicals, large amounts of rinse water, and elevated temperatures to remove particles, metals, and organic matter from the surface. Poor understanding of the mechanisms of …
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Chemistry, Detection, and Control of Metals during Silicon Processing
… of integrated circuits (ICs) on silicon wafers. Chapter 1 begins with an overview of IC manufacturing, including discussion of the common aqueous cleaning solutions, metallization processes, and analytical techniques that will be investigated in subsequent chapters. Chapter 2 covers …