Global ETD Search
Search theses and dissertations gathered from participating repositories worldwide. Every result links back to the library that holds it. No account is needed.
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Showing 1 to 20 of 592 for “"wafer"”.
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Silicon micromachined wafer-bonded valves
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993.
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Wafer Level Characterization of Infrared Detectors
… five years primarily driven by a manufacturable wafer level fabrication process for these detectors. A recent DARPA program called Wafer level Infrared Detectors (WIRED) is exploring new integration schemes for developing low cost photonic detectors, which have higher speed and sensitivity …
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Through-wafer interrogation of MEMS device motion
… device itself. This research explores a through-wafer method of optically monitoring and characterizing the motion of a lateral comb resonator fabricated using the Multi-User MEMS Process Service (MUMPS). Positional monitoring results obtained from a 1.3 mum wavelength through-wafer optical probe …
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Ultrathin silicon wafer bonding physics and applications
Ultrathin silicon wafer bonding is an emerging process that simplifies device fabrication, reduces manufacturing costs, increases yield, and allows the realization of novel devices. Ultrathin silicon wafers are between 3 and 200 microns thick with all the same properties of the thicker silicon …
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Micromachined infrared detector using wafer bonding technology
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1996.
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Silicon cast wafer recrystallization for photovoltaic applications
… methods of manufacturing silicon wafers for photovoltaic (PV) cells define the electrical properties of the wafer in a first step, and then the geometry of the wafer in a subsequent step. The geometry is typically defined by a combination of grinding and abrasive wire sawing. While …
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Copper wafer bonding in three-dimensional integration
… in integrated circuits keep shrinking. Copper wafer bonding has been considered as a strong candidate for fabrication of three-dimensional integrated circuits (3-D IC). This thesis work involves fundamental studies of copper wafer bonding and bonding performance of bonded interconnects. Copper …
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Gas-phase cleaning of silicon wafer surfaces
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Chemical Engineering, 1997.
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Wafer bonding : mechanics-based models and experiments
Direct wafer bonding has emerged as an important technology in the manufacture of silicon-on-insulator substrates (SOI), microelectromechanical systems (MEMS), and three-dimensional integrated circuits (3D IC's). While the process is currently employed in applications such as these, a lack of …
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Silicon pressure sensor using wafer bonding technology
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993.
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Silicon wafer integration of ion electrospray thrusters
… accelerating trend is a fully integrated silicon wafer satellite. Such a large surface area to volume ratio, however, both necessitates propulsion capability and renders other mechanisms of control unfeasible due to their respective form factors. While development of electrospray thrusters has …
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Wafer defect prediction with statistical machine learning
… there exists a potential to improve the wafer sort process using random forest classifier on wafer and die-level datasets. Yet more development is needed to conclude final memory test defect die-level predictions are possible. Key findings include the importance of model computational …
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Cycle time reduction through wafer starts control
… variability, a new methodology of conducting wafer starts was developed and pilot implementations were conducted. The new methodology was based upon the concept of Little's Law of Cycle Time = Inventory / Output, whereby controlling the level of inventory through wafer starts would positively …
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Analysis of column interconnects for wafer level packages
… analysis of Copper column (CuC) interconnect for wafer level packages. First, a simulation-based design optimization process was established based on ABAQUS and Minitab. This process integrated finite element simulation, design of experiment and numerical optimization, generating a systematic and …
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Three dimensional integration technology using copper wafer bonding
… integration flow has been developed on both the wafer-and-die-level, and the enabling technologies were the following: Low temperature Cu-Cu thermocompression bonding, an aluminum-Cu based temporary laminate structure used stabilizing the handle wafer - SOI wafer bond, and tooling optimization of …
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Integrated silicon pressure sensors using wafer bonding technology
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1997.
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Scheduling of Wafer Test Processes in Semiconductor Manufacturing
… manufacturing environment. Semiconductor wafer devices undergo a series of test processes conducted on computer-controlled test stations at various temperatures. A test process consists of both setup operations and processing operations on the test stations. The test operations occur in a …
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Composite Structural Health Monitoring With Piezoelectric Wafer Active Sensors
… the embeddable low-profile piezoelectric wafer active sensors (PWAS). PWAS utilize the piezoelectric principle to convert electric energy to mechanical energy or mechanical energy back to electrical energy. This type of sensor can be readily mounted on the existing structures or embedded …
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