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Showing 1 to 7 of 7 for “"via-holes"”.

  1. BULK TITANIUM WAVEGUIDE- A NEW PLATFORM FOR UNIPLANAR MICROWAVE CIRCUITS AND RFMEMS

    … design flexibility, and the necessity of large via holes. CPW improves upon microstrip by bringing the ground to the same level as the signal, therefore providing low dispersion, smaller circuit size, high design flexibility and no via holes. However, the fields in CPW concentrate on the thin …

    cornell Repository record for BULK TITANIUM WAVEGUIDE- A NEW PLATFORM FOR UNIPLANAR MICROWAVE CIRCUITS AND RFMEMS (opens in a new tab)

  2. Radio frequency driven direct current electron beam source

    … during CF4 plasma etching of 0.45 pm diameter via holes, the electron beam is shown to reduce microtrenching as compared to standard ion-assisted etching, as verified with scanning electron microscopic photos. A simple electrostatic model is used to explain the etch profile improvement.

    colostate Repository record for Radio frequency driven direct current electron beam source (opens in a new tab)

  3. Investigation of explicit finite-element time-domain methods and modeling of dispersive media and 3D high-speed circuits

    … problem containing only the unknowns at the via holes is obtained. The interface problem is then solved and the volume unknowns in each subdomain are recovered. This method maintains the unconditional stability of the finite element time-domain (FETD) method and generates results that are …

    uiuc Repository record for Investigation of explicit finite-element time-domain methods and modeling of dispersive media and 3D high-speed circuits (opens in a new tab)

  4. Modeling and simulation for signal and power integrity of electronic packages

    … Typically, planes have discontinuities such as via holes, plane cutouts, and split planes that disturb flow of signal return currents. At the discontinuity, return currents have to detour or switch to different layers, causing signal and power integrity problems. Therefore, a separate analysis …

    gatech Repository record for Modeling and simulation for signal and power integrity of electronic packages (opens in a new tab)

  5. Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules

    … design parameters such as the interconnect via holes pattern and size, the metallization thickness, as well as the metallization materials were also explored to achieve best results based on thermal and stress analyses. With identified potential thermal problems and critical thermal design …

    vt Repository record for Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules (opens in a new tab)

  6. Integración de elementos activos en estructuras SIW

    Esta tesis está dedicada a estudiar la viabilidad de integrar elementos activos en estructuras SIW, Substrate Integrated Waveguide. Para ello, en primer lugar, se ha estudiado en profundidad la tecnología SIW con el objetivo de conocer su funcionamiento interno y las limitaciones de su topología …

    oviedo Repository record for Integración de elementos activos en estructuras SIW (opens in a new tab)

  7. Efficient Finite Element Electromagnetic Analysis for High-Frequency/High-Speed Circuits And Multiconductor Transmission Lines

    This dissertation comprises the following four components. (1) Development of a robust and efficient 3-D finite element electromagnetic field solver with high-order vector elements for high-frequency and high-speed circuit simulations. The solver supports wave port and lumped port excitations as …

    uiuc Repository record for Efficient Finite Element Electromagnetic Analysis for High-Frequency/High-Speed Circuits And Multiconductor Transmission Lines (opens in a new tab)