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Showing 1 to 13 of 13 for “"underfill"”.

  1. Underfill material selection for flip chip technology

    Chiang, Diana C. (Diana Chih-Chan), 1975-Massachusetts Institute of Technology1998

    Six underfill materials were examined for the selection of an appropriate underfill material for Digital Equipment Corporation's flip chip development project. Several tests were performed to determine the material properties, process properties, and the reliability of each underfill material. A …

    mit Repository record

  2. Study on the Nanocomposite Underfill for Flip-Chip Application

    Sun, YangyangGeorgia Institute of Technology2006

    Underfill material is a special colloidal dispersion system with silicon dioxide particles in the organic liquid. It is used to improve the reliability of integrated circuits (IC) packaging in the microelectronics. In order to successfully synthesize the nanocomposite underfill meeting the …

    gatech Repository record

  3. Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life

    Chilakamarthi, Geetha

    <p>The influence of underfill material properties on the fatigue life of Ball Grid Array (BGA) packages that are subjected to thermal cycling is investigated in this study. A finite element model is created using Ansys by assuming the existence of an infinite array of solder interconnects, …

    uno Repository record

  4. Effects of underfill material on solder deformation and damage in 3D packages

    Flores, Geno

    … periodic boundary condition and the presence of underfill material on the stress and strain fields and evolution of failure of an FEA model that is representative of a solder joint in a 3D IC package. The model solder joint is placed between two silicon substrates in contact with through-silicon …

    unm Repository record

  5. A Study of Microwave curing of Underfill using Open and Closed microwave ovens

    Thakare, Aditya

    portland-state Repository record

  6. High throughput flip chip assembly process application and assessment using no-flow underfill materials

    Milner, David WilliamGeorgia Institute of Technology2001

    gatech Repository record

  7. Numerical analysis of surface mount electronics with viscoelastic epoxy underfills and potting

    Neidigk, Matthew

    … Cracking of encapsulants or ceramic components, underfill debonding, and solder fatigue are just a few of the potential failure mechanisms that may result. An extensive numerical parameter study was performed to investigate the response representative surface mount components to thermal cycling. …

    unm Repository record

  8. DEVELOPMENT AND IN-SITU CHARACTERIZATION OF BI-LAYERED LAMINATED COMPOSITES FOR ENHANCED MOISTURE BARRIER PERFORMANCE

    Gandikota, Ibaad2023

    … power MOSFETs by the application of different underfill and potting encapsulations to determine stresses and strains on the solder bumps.

    maryland Repository record

  9. Surface mounted PCB cleaning process improvement and Its impact on manufacturing system performance

    Rajendran, NikithMassachusetts Institute of Technology2011

    … problems like electro-migration, improper mold underfill and increase the chances of failure. This project explores alternative methods for the cleaning process and also identifies the important factors involved in cleaning. A model of the SMT assembly line was created using ARENA software and …

    mit Repository record

  10. Design of experiment analysis of an electronics package lid using finite element analysis

    Bajad, Nupur

    … they account for the performance of die attach/ underfill materials regardless of the small thickness of the layer. The FEA data are finally used to conduct a design of experiments (DOE) analysis to investigate the influence of 3 distinct designs and 6 material choices on warpage of a lid. The …

    binghamton Repository record

  11. Renal Epithelial Sodium Channel (ENaC) Regulation of Pregnancy Mediated Hemodynamic Adaptations: Mechanistic Insights

    West, Crystal2021

    … theme of pregnancy as a state of arterial underfilling. We performed a Na transporter profile in kidney cortex homogenates from animals treated chronically with vasodilators (nifidipine or sodium nitrate). We found that only the abundance of transporters in the distal nephron (NCC, ENaC, …

    vcu Repository record

  12. Processing and Reliability Assessment of Solder Joint Interconnection for Power Chips

    Liu, XingshengVirginia Tech2001

    … process for improved solder joint geometry, underfilling solder joint with encapsulant and applying flexible substrate in the assembly. The third objective is the implementation of solder joint interconnection technique in developing chip-scale power packages and a three-dimensional …

    vt Repository record

  13. Low Volume Dispensing with High Speed Dispensers

    AGARWAL, SUNNY, <p><a href="https://orcid.org/0009-0007-6780-7174">Sunny Agarwal (0009-0007-6780-7174) - ORCID</a></p>

    <p>With the high pace of innovation in the semiconductor manufacturing industry, there has been an increasing demand for more energy efficient and environmental friendly products. This research relates to a complex process of fluid dispensing at low volumes on a printed circuit board. Currently, a …

    binghamton Repository record