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Showing 1 to 6 of 6 for “"thin film substrate"”.
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An Analysis of Non-Uniform Stress States in Finite Thin Film/substrate System: The Need of Full-Field Curvature Measurements
"Current methodologies used for the inference of thin film stresses through curvatures are strictly restricted to stress and curvature states which are assumed to remain uniform over the entire film/substrate system. In this dissertation, we extend these methodologies to non-uniform stress and …
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Multiscale Modeling and Applications in Nanotribology
… simulation of nanoindentation on a 2D polymer substrate. A good agreement between the multiscale simulation and pure molecular mechanics simulation shows the proposed multiscale approach is accurate and is capable of scaling up the modeling of amorphous materials. The distinguishing features of …
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Stress and deformation of thin films and patterned lines on substrates
The thermomechanical response of thin films/lines on thicker substrates under internal loadings resulting from material mismatch is examined. As the well-known Stoney formula is limited to isotropic, blanket films that undergo only small deformations, proper interpretation of curvature-stress …
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Dynamic delamination of patterned thin films
… to extract the fracture toughness of the thin film/substrate interface. The testing method involves using a laser-induced acoustic stress wave to load the film/substrate fracture plane in tension at very high strain rate (~10^7/s) leading to the inertia-driven interface delamination. A …
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Molecular tailoring of interfaces for thin film on substrate systems
Thin film on substrate systems appear most prevalently within the microelectronics industry, which demands that devices operate in smaller and smaller packages with greater reliability. The reliability of these multilayer film systems is strongly influenced by the adhesion of each of the bimaterial …
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The thermal boundary conductance between a thin ⁴He film and its substrate
Heat flow between the substrate and a thin 4He film is responsible for the signal strength and the Q of a third sound resonance cell. Careful analysis of the signal strength and Q for films between 1.35 and 4.40 atomic layers shows that the boundary conductance between a thin film and its substrate …