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Showing 1 to 7 of 7 for “"thin film adhesion"”.

  1. Thin -Film Adhesion Measurement by Laser -Induced Stress Waves

    … and then allowed to impinge upon the test film. By allowing the initial longitudinal wave to mode convert to a shear wave and a secondary longitudinal wave at the oblique surface, mixed-mode loading of the thin film interface is realized. Film failure under mixed-mode conditions is observed …

    uiuc Repository record for Thin -Film Adhesion Measurement by Laser -Induced Stress Waves (opens in a new tab)

  2. Quantitative evaluation of thin film adhesion using the probe test

    … as a quantitative tool for measuring the adhesion in thin adhesive films and coatings. The technique was initially developed as a qualitative test by the Hewlett-Packard Company for measuring adhesion of thin film microelectronic coatings. In the probe test method, an inclined needle-like …

    vt Repository record for Quantitative evaluation of thin film adhesion using the probe test (opens in a new tab)

  3. The development of the peninsula blister fracture test for adhesively bonded joints

    … blister test to quantitatively measure the adhesion of various adhesively bonded joints. Analytical results reveal that this peninsula-like geometry benefits from both a constant strain energy release rate over the major portion of the debond length and a high strain energy release rate at …

    vt Repository record for The development of the peninsula blister fracture test for adhesively bonded joints (opens in a new tab)

  4. Deposition and characterization of HfO₂ thin films

    Hafnium Dioxide(HfO₂) thin films were deposited on glass, metal, and silicon wafer substrates using magnetron RF reactive sputtering techniques. Structure and morphology of the thin films were investigated by x-ray diffraction (XRD), transmission electron microscopy (TEM) and scanning electron …

    vt Repository record for Deposition and characterization of HfO₂ thin films (opens in a new tab)

  5. Computational modeling of laser-induced delamination testing of thin films

    Thin film adhesion often determines microelectronic device reliability and it is therefore essential to have experimental techniques that accurately and efficiently characterize it. Laser-induced delamination is a novel technique that uses laser-generated stress waves to load thin films at high …

    uiuc Repository record for Computational modeling of laser-induced delamination testing of thin films (opens in a new tab)

  6. Molecular tailoring of interfaces for thin film on substrate systems

    Thin film on substrate systems appear most prevalently within the microelectronics industry, which demands that devices operate in smaller and smaller packages with greater reliability. The reliability of these multilayer film systems is strongly influenced by the adhesion of each of the bimaterial …

    uiuc Repository record for Molecular tailoring of interfaces for thin film on substrate systems (opens in a new tab)

  7. Micro & nano scale mechanical testing and assembly with applications to metal based microsystems

    … The mold inserts are coated with hard ceramic thin films, which could reduce friction and act as barriers for surface chemical reactions during molding at elevated temperatures. The adhesion between thin film and substrate, a persisting topic in thin film technologies and surface engineering, …

    lsu-thes Repository record for Micro & nano scale mechanical testing and assembly with applications to metal based microsystems (opens in a new tab)